P

Inventor

YODA TSUYOSHI

JP22 patents
⚠️ This page may combine multiple inventors who share the name “YODA TSUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEIKO EPSON CORP

18 patents
US7784913B2Aug 31, 2010

Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method

SEIKO EPSON CORP7 citations73
US9579892B2Feb 28, 2017

Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus

SEIKO EPSON CORP2 citations72
US9349673B2May 24, 2016

Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus

SEIKO EPSON CORP6 citations72
US9254653B2Feb 9, 2016

Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus

SEIKO EPSON CORP3 citations72
US9437489B2Sep 6, 2016

Method of manufacturing a wiring substrate

SEIKO EPSON CORP2 citations62
US7326639B2Feb 5, 2008

Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating

SEIKO EPSON CORP2 citations62
US6900117B2May 31, 2005

Method of fabricating bumps utilizing a resist layer having photosensitive agent and resin

SEIKO EPSON CORP5 citations62
US8796823B2Aug 5, 2014

Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus

SEIKO EPSON CORP3 citations61
US10377134B2Aug 13, 2019

MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method

SEIKO EPSON CORP0 citations52
US9822452B2Nov 21, 2017

Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus

SEIKO EPSON CORP0 citations51
US9257404B2Feb 9, 2016

Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus

SEIKO EPSON CORP0 citations51
US7390079B2Jun 24, 2008

Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus

SEIKO EPSON CORP0 citations51
US10121957B2Nov 6, 2018

Method for manufacturing a liquid discharging head or portion thereof

SEIKO EPSON CORP0 citations41
US9708715B2Jul 18, 2017

Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus

SEIKO EPSON CORP0 citations41
US9517624B2Dec 13, 2016

Wiring mounting structure and method of manufacturing the same, and liquid ejecting head and liquid ejecting apparatus

SEIKO EPSON CORP0 citations41
US8960861B2Feb 24, 2015

Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head

SEIKO EPSON CORP0 citations41
US7521797B2Apr 21, 2009

Method of manufacturing substrate joint body, substrate joint body and electrooptical device

SEIKO EPSON CORP0 citations41
US9902150B2Feb 27, 2018

Liquid ejecting head, and manufacturing method of liquid ejecting head

SEIKO EPSON CORP0 citations40

YODA TSUYOSHI

4 patents