Inventor
YODA TSUYOSHI
JP22 patents
⚠️ This page may combine multiple inventors who share the name “YODA TSUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEIKO EPSON CORP
18 patentsUS7784913B2Aug 31, 2010
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
SEIKO EPSON CORP7 citations73
US9579892B2Feb 28, 2017
Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus
SEIKO EPSON CORP2 citations72
US9349673B2May 24, 2016
Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus
SEIKO EPSON CORP6 citations72
US9254653B2Feb 9, 2016
Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus
SEIKO EPSON CORP3 citations72
US9437489B2Sep 6, 2016
Method of manufacturing a wiring substrate
SEIKO EPSON CORP2 citations62
US7326639B2Feb 5, 2008
Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating
SEIKO EPSON CORP2 citations62
US6900117B2May 31, 2005
Method of fabricating bumps utilizing a resist layer having photosensitive agent and resin
SEIKO EPSON CORP5 citations62
US8796823B2Aug 5, 2014
Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
SEIKO EPSON CORP3 citations61
US10377134B2Aug 13, 2019
MEMS device, liquid ejecting head, liquid ejecting apparatus, and MEMS device manufacturing method
SEIKO EPSON CORP0 citations52
US9822452B2Nov 21, 2017
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
SEIKO EPSON CORP0 citations51
US9257404B2Feb 9, 2016
Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
SEIKO EPSON CORP0 citations51
US7390079B2Jun 24, 2008
Device mounting structure, device mounting method, electronic apparatus, liquid droplet ejection head, and liquid droplet ejection apparatus
SEIKO EPSON CORP0 citations51
US10121957B2Nov 6, 2018
Method for manufacturing a liquid discharging head or portion thereof
SEIKO EPSON CORP0 citations41
US9708715B2Jul 18, 2017
Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus
SEIKO EPSON CORP0 citations41
US9517624B2Dec 13, 2016
Wiring mounting structure and method of manufacturing the same, and liquid ejecting head and liquid ejecting apparatus
SEIKO EPSON CORP0 citations41
US8960861B2Feb 24, 2015
Liquid droplet ejecting head, printing apparatus and method of manufacturing liquid droplet ejecting head
SEIKO EPSON CORP0 citations41
US7521797B2Apr 21, 2009
Method of manufacturing substrate joint body, substrate joint body and electrooptical device
SEIKO EPSON CORP0 citations41
US9902150B2Feb 27, 2018
Liquid ejecting head, and manufacturing method of liquid ejecting head
SEIKO EPSON CORP0 citations40
YODA TSUYOSHI
4 patentsUS9070637B2Jun 30, 2015
Device-mounted substrate, infrared light sensor and through electrode forming method
YODA TSUYOSHI38 citations93
US8330256B2Dec 11, 2012
Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
YODA TSUYOSHI5 citations71
US8839520B2Sep 23, 2014
Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
YODA TSUYOSHI2 citations61
US8621926B2Jan 7, 2014
Wiring substrate, piezoelectric oscillator and gyrosensor
YODA TSUYOSHI2 citations61