Inventor
ZHONG TING
US14 patents
⚠️ This page may combine multiple inventors who share the name “ZHONG TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
11 patentsUS7391112B2Jun 24, 2008
Capping copper bumps
INTEL CORP91 citations98
US7223695B2May 29, 2007
Methods to deposit metal alloy barrier layers
INTEL CORP18 citations92
US9010618B2Apr 21, 2015
Magnetic attachment structure
INTEL CORP5 citations84
US7087104B2Aug 8, 2006
Preparation of electroless deposition solutions
INTEL CORP16 citations82
US9523713B2Dec 20, 2016
Interconnects including liquid metal
INTEL CORP5 citations71
US7416980B2Aug 26, 2008
Forming a barrier layer in interconnect joints and structures formed thereby
INTEL CORP2 citations62
US7919859B2Apr 5, 2011
Copper die bumps with electromigration cap and plated solder
INTEL CORP4 citations57
US10099307B2Oct 16, 2018
Interconnect alloy material and methods
INTEL CORP0 citations50
US10321573B2Jun 11, 2019
Solder contacts for socket assemblies
INTEL CORP0 citations48
US9860988B2Jan 2, 2018
Solder contacts for socket assemblies
INTEL CORP0 citations48
US9731369B2Aug 15, 2017
Interconnect alloy material and methods
INTEL CORP1 citations46