P

Inventor

YANG TIEN-CHUNG

TW28 patents
⚠️ This page may combine multiple inventors who share the name “YANG TIEN-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

23 patents
US10090284B2Oct 2, 2018

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD43 citations94
US9859258B2Jan 2, 2018

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD40 citations94
US9793246B1Oct 17, 2017

Pop devices and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD30 citations94
US11177238B2Nov 16, 2021

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10510715B2Dec 17, 2019

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10163701B2Dec 25, 2018

Multi-stack package-on-package structures

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9806059B1Oct 31, 2017

Multi-stack package-on-package structures

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US9922939B2Mar 20, 2018

Wafer level shielding in multi-stacked fan out packages and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US9659878B2May 23, 2017

Wafer level shielding in multi-stacked fan out packages and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations83
US11842983B2Dec 12, 2023

Semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9941248B2Apr 10, 2018

Package structures, pop devices and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10276542B2Apr 30, 2019

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12243833B2Mar 4, 2025

Semiconductor device with electromagnetic interference film and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11145633B2Oct 12, 2021

Semiconductor package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11133197B2Sep 28, 2021

Semiconductor structure and method of forming

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US10825780B2Nov 3, 2020

Semiconductor device with electromagnetic interference protection and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12482763B2Nov 25, 2025

Semiconductor device package and methods of formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12476178B2Nov 18, 2025

Reduction of cracks in redistribution structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12469807B2Nov 11, 2025

Fan-out package structures with cascaded openings in enhancement layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10340155B2Jul 2, 2019

Semiconductor structure and method of forming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10217687B2Feb 26, 2019

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9929069B2Mar 27, 2018

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9564345B1Feb 7, 2017

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

PIXART IMAGING INC

4 patents

YANG TIEN-CHUNG

1 patent