Inventor

SCHOBER WOLFGANG

DE42 patents

⚠️ This page may combine multiple inventors who share the name “SCHOBER WOLFGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SCHOBER WOLFGANG

INFINEON TECHNOLOGIES AG

Semiconductor device having a sensor chip, and method for producing the same

Sensor component with a cavity housing and a sensor chip and method for producing the same

Semiconductor component and sensor component for data transmission devices

Semiconductor module with at least two substrates

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor component including semiconductor chip and method for producing the same

Semiconductor device with semiconductor chip and method for producing it

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Electronic device

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

Semiconductor chip comprising a metal coating structure and associated production method

Layer between interfaces of different components in semiconductor devices

Lead structure for a semiconductor component and method for producing the same

Electrically conductive body including an adhesion promoter layer, and process for depositing an adhesion promoter layer

Metal article intended for at least partially coating with a substance and a method for producing the same

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

Component arrangement comprising a carrier

Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite

Semiconductor component having a stack of semiconductor chips and method for producing the same

Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition

Electronic module with a semiconductor chip and a component housing and methods for producing the same

Chip embedding package with solderable electric contact

KUKA DEUTSCHLAND GMBH

Surgical instrument, arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrument

Surgical instrument arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrument

Robot gripper

Robotic surgery system

Robotic surgery system

Surgical instrument arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrument

Robot assembly

Robotic surgery system and surgical instrument

Surgical robot system

KUKA LAB GMBH

Robotic surgery system and surgical instrument

Robotic surgery system and surgical instrument

Robotic surgery system and surgical instrument

Surgical instrument arrangement and drive train arrangement for a surgical instrument, in particular a robot-guided surgical instrument, and surgical instrument

MAHLER JOACHIM

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

Semiconductor component and production method

Semiconductor component and production method

RIEDL EDMUND

Method for producing a metal article intended for at least partially coating with a substance