Inventor

KANG SUN-WON

KR42 patents

⚠️ This page may combine multiple inventors who share the name “KANG SUN-WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG SUN-WON

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Three-dimensional semiconductor module having multi-sided ground block

Semiconductor chip package having decoupling capacitor and manufacturing method thereof

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package

Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same

Semiconductor package apparatus

Semiconductor memory device having improved voltage transmission path and driving method thereof

Packaged semiconductor die and manufacturing method thereof

Semiconductor memory chip, semiconductor memory package, and electronic system using the same

Semiconductor chip and semiconductor package including the same

Semiconductor package

Semiconductor package

Chip stack package

Semiconductor memory device having improved voltage transmission path and driving method thereof

Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module

Test probe for semiconductor package

Semiconductor memory module having an oblique memory chip

Integrated circuit packages including sinuous lead frames

Semiconductor memory chip, semiconductor memory package, and electronic system using the same

Method of manufacturing chip-on-chip semiconductor device

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

Test probe with planar ground tip extending transversely from the ground barrel for a semiconductor package

Semiconductor package

Printed circuit board having traces and ball grid array package including the same

Semiconductor device and semiconductor package including the same

Semiconductor device and semiconductor package including the same

KANG SUN-WON

Wafer-level stack package

Semiconductor chip, and semiconductor package and system each including the semiconductor chip

Semiconductor module

Semiconductor module

Chip stack package

Semiconductor memory device having improved voltage transmission path and driving method thereof

HYUNDAI MOTOR CO LTD

Outside door handle automatic locking device for automobiles

Vehicular power window safety device

BAEK SEUNG-DUK

Semiconductor device including redistribution line structure and method of fabricating the same

Stack package

PARK CHUL

Integrated circuit packages having redistribution structures

LEE KWANG-YONG

Mounting substrate

SAMSUNG ELECTRONICS LTD

Semiconductor package

PARK JIN-WOO

Integrated circuit chip and flip chip package having the integrated circuit chip

CHA SEUNG-YONG

Semiconductor chip and semiconductor module including the semiconductor chip