Inventor
MISRA SUDHANSHU
US47 patents
⚠️ This page may combine multiple inventors who share the name “MISRA SUDHANSHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AGERE SYST GUARDIAN CORP
15 patentsUS6461225B1Oct 8, 2002
Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP)
AGERE SYST GUARDIAN CORP39 citations93
US6410419B1Jun 25, 2002
Silicon carbide barrier layers for porous low dielectric constant materials
AGERE SYST GUARDIAN CORP29 citations93
US6368200B1Apr 9, 2002
Polishing pads from closed-cell elastomer foam
AGERE SYST GUARDIAN CORP43 citations93
US6364744B1Apr 2, 2002
CMP system and slurry for polishing semiconductor wafers and related method
AGERE SYST GUARDIAN CORP50 citations93
US6599837B1Jul 29, 2003
Chemical mechanical polishing composition and method of polishing metal layers using same
AGERE SYST GUARDIAN CORP16 citations84
US6458289B1Oct 1, 2002
CMP slurry for polishing semiconductor wafers and related methods
AGERE SYST GUARDIAN CORP17 citations84
US6436807B1Aug 20, 2002
Method for making an interconnect layer and a semiconductor device including the same
AGERE SYST GUARDIAN CORP15 citations81
US6436830B1Aug 20, 2002
CMP system for polishing semiconductor wafers and related method
AGERE SYST GUARDIAN CORP8 citations74
US6319095B1Nov 20, 2001
Colloidal suspension of abrasive particles containing magnesium as CMP slurry
AGERE SYST GUARDIAN CORP14 citations74
US6312565B1Nov 6, 2001
Thin film deposition of mixed metal oxides
AGERE SYST GUARDIAN CORP10 citations74
US6293847B1Sep 25, 2001
Apparatus for chemical mechanical polishing endpoint detection using a hydrogen sensor
AGERE SYST GUARDIAN CORP11 citations73
US6258231B1Jul 10, 2001
Chemical mechanical polishing endpoint apparatus using component activity in effluent slurry
AGERE SYST GUARDIAN CORP12 citations73
US6328633B1Dec 11, 2001
Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
AGERE SYST GUARDIAN CORP5 citations71
US6471925B1Oct 29, 2002
Method for treating an effluent gas during semiconductor processing
AGERE SYST GUARDIAN CORP5 citations63
US6439972B2Aug 27, 2002
Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method
AGERE SYST GUARDIAN CORP5 citations60
NEXPLANAR CORP
8 patentsUS7704125B2Apr 27, 2010
Customized polishing pads for CMP and methods of fabrication and use thereof
NEXPLANAR CORP60 citations97
US9278424B2Mar 8, 2016
Customized polishing pads for CMP and methods of fabrication and use thereof
NEXPLANAR CORP32 citations94
US8380339B2Feb 19, 2013
Customized polish pads for chemical mechanical planarization
NEXPLANAR CORP27 citations93
US7704122B2Apr 27, 2010
Customized polish pads for chemical mechanical planarization
NEXPLANAR CORP29 citations93
US7425172B2Sep 16, 2008
Customized polish pads for chemical mechanical planarization
NEXPLANAR CORP36 citations93
US10220487B2Mar 5, 2019
Customized polishing pads for CMP and methods of fabrication and use thereof
NEXPLANAR CORP15 citations85
US9272388B2Mar 1, 2016
Polishing systems
NEXPLANAR CORP2 citations63
US8383003B2Feb 26, 2013
Polishing systems
NEXPLANAR CORP2 citations63
AGERE SYSTEMS INC
8 patentsUS6659846B2Dec 9, 2003
Pad for chemical mechanical polishing
AGERE SYSTEMS INC28 citations93
US6596639B1Jul 22, 2003
Method for chemical/mechanical planarization of a semiconductor wafer having dissimilar metal pattern densities
AGERE SYSTEMS INC20 citations92
US6683382B2Jan 27, 2004
Semiconductor device having an interconnect layer with a plurality of layout regions having substantially uniform densities of active interconnects and dummy fills
AGERE SYSTEMS INC17 citations89
US6544107B2Apr 8, 2003
Composite polishing pads for chemical-mechanical polishing
AGERE SYSTEMS INC17 citations84
US6524957B2Feb 25, 2003
Method of forming in-situ electroplated oxide passivating film for corrosion inhibition
AGERE SYSTEMS INC16 citations84
US6540974B2Apr 1, 2003
Process for making mixed metal oxides
AGERE SYSTEMS INC8 citations74
US6287970B1Sep 11, 2001
Method of making a semiconductor with copper passivating film
AGERE SYSTEMS INC12 citations72
US6616965B1Sep 9, 2003
Non-hydrolytic-sol-gel process for high K dielectric
AGERE SYSTEMS INC1 citations52
LUCENT TECHNOLOGIES INC
6 patentsUS6071808AJun 6, 2000
Method of passivating copper interconnects in a semiconductor
LUCENT TECHNOLOGIES INC99 citations98
US6100587AAug 8, 2000
Silicon carbide barrier layers for porous low dielectric constant materials
LUCENT TECHNOLOGIES INC72 citations96
US6214732B1Apr 10, 2001
Chemical mechanical polishing endpoint detection by monitoring component activity in effluent slurry
LUCENT TECHNOLOGIES INC15 citations84
US6114234ASep 5, 2000
Method of making a semiconductor with copper passivating film
LUCENT TECHNOLOGIES INC10 citations74
US6375541B1Apr 23, 2002
Polishing fluid polishing method semiconductor device and semiconductor device fabrication method
LUCENT TECHNOLOGIES INC4 citations63
US6130150AOct 10, 2000
Method of making a semiconductor device with barrier and conductor protection
LUCENT TECHNOLOGIES INC6 citations63
CHEMPOWER CORP
4 patentsUS11545365B2Jan 3, 2023
Chemical planarization
CHEMPOWER CORP5 citations71
US12593637B2Mar 31, 2026
Chemical planarization
CHEMPOWER CORP0 citations48
US12500088B2Dec 16, 2025
Tools for chemical planarization
CHEMPOWER CORP0 citations48
US12466025B2Nov 11, 2025
Pad surface regeneration and metal recovery
CHEMPOWER CORP0 citations40