Inventor
JI GU WON
KR30 patents
Patents
30 patentsUS10204739B1Feb 12, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH16 citations94
US10192686B1Jan 29, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH21 citations94
US10128050B1Nov 13, 2018
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH22 citations94
US10062511B1Aug 28, 2018
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH28 citations94
US10566137B2Feb 18, 2020
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH10 citations84
US10347425B2Jul 9, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH12 citations84
US10325722B2Jun 18, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH11 citations84
US11139113B2Oct 5, 2021
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US11004608B2May 11, 2021
Composite electronic component
SAMSUNG ELECTRO MECH4 citations73
US10879000B2Dec 29, 2020
Multilayer ceramic electronic component and interposer included therein
SAMSUNG ELECTRO MECH3 citations73
US10840022B2Nov 17, 2020
Electronic component
SAMSUNG ELECTRO MECH2 citations73
US10777356B2Sep 15, 2020
Electronic component
SAMSUNG ELECTRO MECH4 citations73
US10658118B2May 19, 2020
Electronic component and board having the same
SAMSUNG ELECTRO MECH6 citations73
US10453616B2Oct 22, 2019
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH2 citations73
US10398030B2Aug 27, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH4 citations73
US10980124B2Apr 13, 2021
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations62
US10650970B2May 12, 2020
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH1 citations62
US12437912B2Oct 7, 2025
Coil component
SAMSUNG ELECTRO MECH0 citations52
US11769633B2Sep 26, 2023
Board having multilayer capacitor mounted thereon and multilayer capacitor package
SAMSUNG ELECTRO MECH0 citations52
US11749462B2Sep 5, 2023
Multilayer ceramic electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations52
US11640877B2May 2, 2023
Electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations52
US11581147B2Feb 14, 2023
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US11056281B2Jul 6, 2021
Electronic component
SAMSUNG ELECTRO MECH0 citations52
US11017951B2May 25, 2021
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations52
US10614960B2Apr 7, 2020
Composite electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations52
US10460875B2Oct 29, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations52
US10438748B2Oct 8, 2019
Multilayer electronic component and board having the same
SAMSUNG ELECTRO MECH0 citations52
US11477891B2Oct 18, 2022
Electronic component
SAMSUNG ELECTRO MECH0 citations51
US11133132B2Sep 28, 2021
Electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations51
US11309133B2Apr 19, 2022
Multilayer electronic component and board having the same mounted thereon
SAMSUNG ELECTRO MECH0 citations50