Inventor

YEE ABRAHAM FONG

US2 patents

Patents

2 patents

US10219387B2Feb 26, 2019

Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate

NVIDIA CORP0 citations44

US9659815B2May 23, 2017

System, method, and computer program product for a cavity package-on-package structure

NVIDIA CORP0 citations43