Inventor
BOKHAREY ZUHAIR
US10 patents
⚠️ This page may combine multiple inventors who share the name “BOKHAREY ZUHAIR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NVIDIA CORP
9 patentsUS9385098B2Jul 5, 2016
Variable-size solder bump structures for integrated circuit packaging
NVIDIA CORP17 citations82
US9478482B2Oct 25, 2016
Offset integrated circuit packaging interconnects
NVIDIA CORP3 citations71
US9716051B2Jul 25, 2017
Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity
NVIDIA CORP2 citations70
US9368422B2Jun 14, 2016
Absorbing excess under-fill flow with a solder trench
NVIDIA CORP2 citations59
US11495568B2Nov 8, 2022
IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures
NVIDIA CORP0 citations54
US10943882B1Mar 9, 2021
IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures
NVIDIA CORP0 citations54
US9368439B2Jun 14, 2016
Substrate build up layer to achieve both finer design rule and better package coplanarity
NVIDIA CORP0 citations50
US9760132B2Sep 12, 2017
Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad
NVIDIA CORP0 citations49
US10219387B2Feb 26, 2019
Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate
NVIDIA CORP0 citations44