Inventor

KASUGA TAKASHI

JP30 patents

⚠️ This page may combine multiple inventors who share the name “KASUGA TAKASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KASUGA TAKASHI

SUMITOMO ELECTRIC INDUSTRIES

Conductive silver paste and conductive film formed using the same

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Substrate for printed circuit board and method for producing substrate for printed circuit board

Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board

Method of producing metal powder

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Base material for printed circuit board and printed circuit board

Resin film, substrate for printed wiring board, and printed wiring board

Base material for printed circuit board and printed circuit board

Printed circuit board and electronic component

Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder

Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Printed circuit board and method of manufacturing printed circuit board

Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board

Substrate for printed circuit board and printed circuit board

Printed circuit board and electronic component

SONY CORP

Method for alignment of manufacturing semiconductor apparatus

Delineating method employing electron ray beam

Solid-state imaging device and method for manufacturing solid-state imaging device

Solid-state imaging device and method for manufacturing solid-state imaging device

Contact hole forming method

SHINKO ELECTRIC IND CO

Wiring board

Interconnect substrate having groove around pad

Wiring board and manufacturing method of wiring board

Built-in component board, method of manufacturing the built-in component board

Wiring substrate and method of manufacturing wiring substrate

KASUGA TAKASHI

Seal structure, method of forming seal structure, wire body, and electronic apparatus

OKA YOSHIO

Flexible printed wiring board