P

Inventor

TEY CHING-HWA

SG27 patents
⚠️ This page may combine multiple inventors who share the name “TEY CHING-HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

23 patents
US9941161B2Apr 10, 2018

Method for fabricating semiconductor device

UNITED MICROELECTRONICS CORP7 citations83
US12040224B2Jul 16, 2024

Transistor structure with air gap and method of fabricating the same

UNITED MICROELECTRONICS CORP3 citations74
US11355389B2Jun 7, 2022

Transistor structure with air gap and method of fabricating the same

UNITED MICROELECTRONICS CORP4 citations72
US9583594B2Feb 28, 2017

Method of fabricating semiconductor device

UNITED MICROELECTRONICS CORP2 citations72
US11641000B2May 2, 2023

Image sensor and manufacturing method thereof

UNITED MICROELECTRONICS CORP2 citations71
US9685387B1Jun 20, 2017

Test key for checking the window of a doped region and method of using the test key

UNITED MICROELECTRONICS CORP2 citations71
US9276057B2Mar 1, 2016

Capacitor structure and method of manufacturing the same

UNITED MICROELECTRONICS CORP6 citations71
US12094758B2Sep 17, 2024

Semiconductor structure and method for manufacturing the same

UNITED MICROELECTRONICS CORP2 citations66
US12424487B2Sep 23, 2025

Transistor structure with air gap and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations62
US10909299B1Feb 2, 2021

Method for stabilizing bandgap voltage

UNITED MICROELECTRONICS CORP0 citations62
US12563883B2Feb 24, 2026

Image sensor and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations60
US12176375B2Dec 24, 2024

Image sensor structure including nanowire structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP1 citations60
US12094896B2Sep 17, 2024

Photosensitive semiconductor device including heterojunction photodiode

UNITED MICROELECTRONICS CORP0 citations60
US12080734B2Sep 3, 2024

Photosensitive semiconductor device including heterojunction photodiode

UNITED MICROELECTRONICS CORP0 citations60
US11527561B2Dec 13, 2022

Photosensitive semiconductor device including top surface photodiode

UNITED MICROELECTRONICS CORP0 citations60
US11127621B2Sep 21, 2021

Method of forming semiconductor device

UNITED MICROELECTRONICS CORP0 citations60
US11101361B1Aug 24, 2021

Gate-all-around (GAA) transistor and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations60
US9023726B1May 5, 2015

Method of fabricating semiconductor device

UNITED MICROELECTRONICS CORP2 citations60
US9305887B2Apr 5, 2016

Seal ring structure with a v-shaped dielectric layer conformally overlapping a conductive layer

UNITED MICROELECTRONICS CORP2 citations56
US12433042B2Sep 30, 2025

Image sensor structure and manufacturing method thereof

UNITED MICROELECTRONICS CORP0 citations51
US9401280B2Jul 26, 2016

Semiconductor process

UNITED MICROELECTRONICS CORP1 citations51
US10332839B2Jun 25, 2019

Interconnect structure and fabricating method thereof

UNITED MICROELECTRONICS CORP0 citations45
US11527605B2Dec 13, 2022

Method for fabricating metal-oxide-metal capacitor

UNITED MICROELECTRONICS CORP0 citations41

LIAO DUAN QUAN

2 patents

KONINKL PHILIPS ELECTRONICS NV

1 patent

LIAO DUAN-QUAN

1 patent