Inventor
HAMANO KENICHI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “HAMANO KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
13 patentsUS9957638B2May 1, 2018
Method for manufacturing silicon carbide semiconductor device
MITSUBISHI ELECTRIC CORP2 citations72
US9988738B2Jun 5, 2018
Method for manufacturing SiC epitaxial wafer
MITSUBISHI ELECTRIC CORP3 citations71
US9422640B2Aug 23, 2016
Single-crystal 4H-SiC substrate
MITSUBISHI ELECTRIC CORP1 citations62
US10707075B2Jul 7, 2020
Semiconductor wafer, semiconductor device, and method for producing semiconductor device
MITSUBISHI ELECTRIC CORP1 citations61
US10950435B2Mar 16, 2021
SiC epitaxial wafer, method for manufacturing SiC epitaxial wafer, SiC device, and power conversion apparatus
MITSUBISHI ELECTRIC CORP1 citations60
US10711372B2Jul 14, 2020
Silicon carbide epitaxial wafer manufacturing method, silicon carbide semiconductor device manufacturing method and silicon carbide epitaxial wafer manufacturing apparatus
MITSUBISHI ELECTRIC CORP0 citations51
US10370775B2Aug 6, 2019
Silicon carbide epitaxial wafer manufacturing method, silicon carbide semiconductor device manufacturing method and silicon carbide epitaxial wafer manufacturing apparatus
MITSUBISHI ELECTRIC CORP0 citations51
US9903048B2Feb 27, 2018
Single-crystal 4H-SiC substrate
MITSUBISHI ELECTRIC CORP0 citations51
US9752254B2Sep 5, 2017
Method for manufacturing a single-crystal 4H—SiC substrate
MITSUBISHI ELECTRIC CORP0 citations51
US12369350B2Jul 22, 2025
Silicon carbide semiconductor device with a main cell outputting main current and a sense cell outputting sense current wherein the inclination of temperature dependent properties of the main current is approximately flat in a temperature of 0 *C or less
MITSUBISHI ELECTRIC CORP0 citations50
US11088073B2Aug 10, 2021
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations45
US10508362B2Dec 17, 2019
Substrate mounting member, wafer plate, and SiC epitaxial substrate manufacturing method
MITSUBISHI ELECTRIC CORP0 citations39
US10229830B2Mar 12, 2019
Method of manufacturing silicon carbide epitaxial wafer
MITSUBISHI ELECTRIC CORP0 citations39