P

Inventor

HAMANO KENICHI

JP18 patents
⚠️ This page may combine multiple inventors who share the name “HAMANO KENICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

13 patents
US9957638B2May 1, 2018

Method for manufacturing silicon carbide semiconductor device

MITSUBISHI ELECTRIC CORP2 citations72
US9988738B2Jun 5, 2018

Method for manufacturing SiC epitaxial wafer

MITSUBISHI ELECTRIC CORP3 citations71
US9422640B2Aug 23, 2016

Single-crystal 4H-SiC substrate

MITSUBISHI ELECTRIC CORP1 citations62
US10707075B2Jul 7, 2020

Semiconductor wafer, semiconductor device, and method for producing semiconductor device

MITSUBISHI ELECTRIC CORP1 citations61
US10950435B2Mar 16, 2021

SiC epitaxial wafer, method for manufacturing SiC epitaxial wafer, SiC device, and power conversion apparatus

MITSUBISHI ELECTRIC CORP1 citations60
US10711372B2Jul 14, 2020

Silicon carbide epitaxial wafer manufacturing method, silicon carbide semiconductor device manufacturing method and silicon carbide epitaxial wafer manufacturing apparatus

MITSUBISHI ELECTRIC CORP0 citations51
US10370775B2Aug 6, 2019

Silicon carbide epitaxial wafer manufacturing method, silicon carbide semiconductor device manufacturing method and silicon carbide epitaxial wafer manufacturing apparatus

MITSUBISHI ELECTRIC CORP0 citations51
US9903048B2Feb 27, 2018

Single-crystal 4H-SiC substrate

MITSUBISHI ELECTRIC CORP0 citations51
US9752254B2Sep 5, 2017

Method for manufacturing a single-crystal 4H—SiC substrate

MITSUBISHI ELECTRIC CORP0 citations51
US12369350B2Jul 22, 2025

Silicon carbide semiconductor device with a main cell outputting main current and a sense cell outputting sense current wherein the inclination of temperature dependent properties of the main current is approximately flat in a temperature of 0 *C or less

MITSUBISHI ELECTRIC CORP0 citations50
US11088073B2Aug 10, 2021

Semiconductor device

MITSUBISHI ELECTRIC CORP0 citations45
US10508362B2Dec 17, 2019

Substrate mounting member, wafer plate, and SiC epitaxial substrate manufacturing method

MITSUBISHI ELECTRIC CORP0 citations39
US10229830B2Mar 12, 2019

Method of manufacturing silicon carbide epitaxial wafer

MITSUBISHI ELECTRIC CORP0 citations39

SONY CORP

2 patents

HATTORI RYO

1 patent

HAMANO KENICHI

1 patent

TOMITA NOBUYUKI

1 patent