Inventor
FURUTANI TOSHIKI
JP80 patents
⚠️ This page may combine multiple inventors who share the name “FURUTANI TOSHIKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBIDEN CO LTD
33 patentsUS8971053B2Mar 3, 2015
Wiring board and method for manufacturing the same
IBIDEN CO LTD62 citations98
US7462784B2Dec 9, 2008
Heat resistant substrate incorporated circuit wiring board
IBIDEN CO LTD50 citations96
US8008583B2Aug 30, 2011
Heat resistant substrate incorporated circuit wiring board
IBIDEN CO LTD12 citations92
US7994432B2Aug 9, 2011
Heat resistant substrate incorporated circuit wiring board
IBIDEN CO LTD11 citations92
US7497694B2Mar 3, 2009
Printed board with a pin for mounting a component
IBIDEN CO LTD14 citations92
US9807885B2Oct 31, 2017
Wiring board with built-in electronic component and method for manufacturing the same
IBIDEN CO LTD8 citations84
US9357660B2May 31, 2016
Printed circuit board, and method for manufacturing printed circuit board
IBIDEN CO LTD7 citations84
US7773388B2Aug 10, 2010
Printed wiring board with component mounting pin and electronic device using the same
IBIDEN CO LTD9 citations84
US7495332B2Feb 24, 2009
Multilayer printed wiring board
IBIDEN CO LTD12 citations84
US7489521B2Feb 10, 2009
Multilayer printed wiring board
IBIDEN CO LTD8 citations84
US8347493B2Jan 8, 2013
Wiring board with built-in electronic component and method of manufacturing same
IBIDEN CO LTD8 citations83
US9215805B2Dec 15, 2015
Wiring board with built-in electronic component and method for manufacturing the same
IBIDEN CO LTD8 citations82
US7262975B2Aug 28, 2007
Multilayer printed wiring board
IBIDEN CO LTD8 citations74
US10098243B2Oct 9, 2018
Printed wiring board and semiconductor package
IBIDEN CO LTD3 citations73
US9951434B2Apr 24, 2018
Printed wiring board, semiconductor package and method for manufacturing printed wiring board
IBIDEN CO LTD4 citations73
US9601422B2Mar 21, 2017
Printed wiring board, semiconductor package, and method for manufacturing printed wiring board
IBIDEN CO LTD5 citations73
US9536801B2Jan 3, 2017
Electronic component having encapsulated wiring board and method for manufacturing the same
IBIDEN CO LTD2 citations73
US9497849B2Nov 15, 2016
Printed wiring board
IBIDEN CO LTD4 citations73
US9232656B2Jan 5, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations73
US9439289B2Sep 6, 2016
Wiring board and method for manufacturing the same
IBIDEN CO LTD4 citations72
US8952507B2Feb 10, 2015
Wiring board and method for manufacturing wiring board
IBIDEN CO LTD6 citations72
US10182518B2Jan 15, 2019
Shield cap and method for manufacturing the same
IBIDEN CO LTD2 citations71
US9307643B2Apr 5, 2016
Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component
IBIDEN CO LTD4 citations70
US9474158B2Oct 18, 2016
Printed wiring board
IBIDEN CO LTD2 citations63
US9204552B2Dec 1, 2015
Printed wiring board
IBIDEN CO LTD3 citations63
US7971354B2Jul 5, 2011
Method of manufacturing a multilayer printed wiring board
IBIDEN CO LTD2 citations63
US7881071B2Feb 1, 2011
Multilayer printed wiring board
IBIDEN CO LTD2 citations63
US7754978B2Jul 13, 2010
Multilayer printed wiring board and method of manufacturing the same
IBIDEN CO LTD4 citations63
US10231336B2Mar 12, 2019
Printed wiring board for mounting electronic component
IBIDEN CO LTD1 citations62
US7731504B2Jun 8, 2010
Printed board with component mounting pin
IBIDEN CO LTD3 citations62
US9220168B2Dec 22, 2015
Wiring board with built-in electronic component
IBIDEN CO LTD3 citations54
US12593400B2Mar 31, 2026
Wiring substrate
IBIDEN CO LTD0 citations52
US12336095B2Jun 17, 2025
Wiring substrate and method for manufacturing wiring substrate
IBIDEN CO LTD0 citations52
KARIYA TAKASHI
6 patentsUS8507806B2Aug 13, 2013
Heat resistant substrate incorporated circuit wiring board
KARIYA TAKASHI6 citations83
US8654538B2Feb 18, 2014
Wiring board and method for manufacturing the same
KARIYA TAKASHI5 citations73
US8541691B2Sep 24, 2013
Heat resistant substrate incorporated circuit wiring board
KARIYA TAKASHI4 citations73
US8415781B2Apr 9, 2013
Electronic component and method for manufacturing the same
KARIYA TAKASHI4 citations63
US8225503B2Jul 24, 2012
Method for manufacturing board with built-in electronic elements
KARIYA TAKASHI5 citations63
US8169792B2May 1, 2012
Multilayer printed wiring board
KARIYA TAKASHI3 citations63
FURUTANI TOSHIKI
4 patentsUS8698303B2Apr 15, 2014
Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
FURUTANI TOSHIKI6 citations81
US9059187B2Jun 16, 2015
Electronic component having encapsulated wiring board and method for manufacturing the same
FURUTANI TOSHIKI2 citations62
US8975742B2Mar 10, 2015
Printed wiring board
FURUTANI TOSHIKI3 citations62
US8772648B2Jul 8, 2014
Method for manufacturing printed wiring board and printed wiring board
FURUTANI TOSHIKI2 citations62
SAKAMOTO HAJIME
2 patentsMIKADO YUKINOBU
2 patentsYOSHIKAWA KAZUHIRO
1 patentSAKAI SHUNSUKE
1 patentTOYOTA MOTOR CO LTD
1 patentShowing the top 50 of 80 patents by PatentIndex Score.