Inventor
MAHDI TAYSEER
US8 patents
Patents
8 patentsUS12381161B2Aug 5, 2025
Backside wafer treatments to reduce distortions and overlay errors during wafer chucking
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US11398428B2Jul 26, 2022
Multifunctional molecules for selective polymer formation on conductive surfaces and structures resulting therefrom
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US11024538B2Jun 1, 2021
Hardened plug for improved shorting margin
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US12037434B2Jul 16, 2024
Chemical compositions and methods of patterning microelectronic device structures
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US11217455B2Jan 4, 2022
Carbon-based dielectric materials for semiconductor structure fabrication and the resulting structures
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US12293913B1May 6, 2025
Directed self-assembly enabled subtractive metal patterning
INTEL CORP0 citations57
US12012473B2Jun 18, 2024
Directed self-assembly structures and techniques
INTEL CORP0 citations56
US12036578B1Jul 16, 2024
Interconnect structure surface modifications by passivating agents
INTEL CORP0 citations51