Inventor

ZHOU YAPING

US21 patents

⚠️ This page may combine multiple inventors who share the name “ZHOU YAPING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ZHOU YAPING

FREESCALE SEMICONDUCTOR INC

Inductive device including bond wires

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor package with crossing conductor assembly and method of manufacture

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

NVIDIA CORP

Inductors for integrated voltage regulators

Filtering high speed signals

Interconnection structures to improve signal integrity within stacked dies

Resistance and capacitance balancing systems and methods

Cross talk reduction differential cross over routing systems and methods

HARVEY PAUL M

Method and apparatus to reduce impedance discontinuity in packages

Reducing impedance discontinuity in packages

System to improve coreless package connections

System to improve coreless package connections

WEEKLY ROGER D

Ball grid array with improved single-ended and differential signal performance

Ball grid array with improved single-ended and differential signal performance

Ball grid array with improved single-ended and differential signal performance

ZHOU YAPING

Methods and apparatus for network protection

Voltage controlled on-chip decoupling capacitance to mitigate power supply noise

IBM

Impedane measurement of chip, package, and board power supply system using pseudo impulse response

ERICSSON TELEFON AB L M

Method and apparatus for selecting path from paths between label edge routers