Inventor

THANU DINESH P R

US3 patents

Patents

3 patents

US11652018B2May 16, 2023

Heat spreader edge standoffs for managing bondline thickness in microelectronic packages

INTEL CORP0 citations59

US11062970B2Jul 13, 2021

Heat spreader edge standoffs for managing bondline thickness in microelectronic packages

INTEL CORP0 citations59

US10643938B2May 5, 2020

Standoff spacers for managing bondline thickness in microelectronic packages

INTEL CORP1 citations56