Inventor
DHAVALESWARAPU HEMANTH K
US8 patents
⚠️ This page may combine multiple inventors who share the name “DHAVALESWARAPU HEMANTH K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
7 patentsUS10580717B2Mar 3, 2020
Multiple-chip package with multiple thermal interface materials
INTEL CORP11 citations80
US9735089B2Aug 15, 2017
Thermal management for flexible integrated circuit packages
INTEL CORP2 citations69
US9943931B2Apr 17, 2018
High performance transient uniform cooling solution for thermal compression bonding process
INTEL CORP2 citations68
US11652018B2May 16, 2023
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
INTEL CORP0 citations59
US11062970B2Jul 13, 2021
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
INTEL CORP0 citations59
US10643938B2May 5, 2020
Standoff spacers for managing bondline thickness in microelectronic packages
INTEL CORP1 citations56
US11676873B2Jun 13, 2023
Semiconductor package having sealant bridge
INTEL CORP0 citations53