Inventor
BEATTY JOHN J
US13 patents
⚠️ This page may combine multiple inventors who share the name “BEATTY JOHN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS7183493B2Feb 27, 2007
Electronic assembly having multi-material interconnects
INTEL CORP24 citations90
US11328978B2May 10, 2022
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
INTEL CORP6 citations84
US7179093B2Feb 20, 2007
Retractable ledge socket
INTEL CORP6 citations72
US11776869B2Oct 3, 2023
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
INTEL CORP0 citations61
US11652018B2May 16, 2023
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
INTEL CORP0 citations59
US11328979B2May 10, 2022
Substrate integrated posts and heat spreader customization for enhanced package thermomechanics
INTEL CORP1 citations59
US11062970B2Jul 13, 2021
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
INTEL CORP0 citations59
US11652061B2May 16, 2023
Package-level backside metallization (BSM)
INTEL CORP0 citations57
US10643938B2May 5, 2020
Standoff spacers for managing bondline thickness in microelectronic packages
INTEL CORP1 citations56
US11676873B2Jun 13, 2023
Semiconductor package having sealant bridge
INTEL CORP0 citations53
US7421778B2Sep 9, 2008
Method of making an electronic assembly
INTEL CORP0 citations50
US10290592B2May 14, 2019
Semiconductor package, and a method for forming a semiconductor package
INTEL CORP0 citations49