Inventor
JAIN SYADWAD
US10 patents
Patents
10 patentsUS8896110B2Nov 25, 2014
Paste thermal interface materials
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US9070660B2Jun 30, 2015
Polymer thermal interface material having enhanced thermal conductivity
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US10580717B2Mar 3, 2020
Multiple-chip package with multiple thermal interface materials
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US10056314B2Aug 21, 2018
Polymer thermal interface material having enhanced thermal conductivity
INTEL CORP3 citations72
US10651108B2May 12, 2020
Foam composite
INTEL CORP4 citations71
US10969840B2Apr 6, 2021
Heat spreaders with interlocked inserts
INTEL CORP1 citations61
US8866290B2Oct 21, 2014
Molded heat spreaders
INTEL CORP2 citations61
US11652018B2May 16, 2023
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
INTEL CORP0 citations59
US11062970B2Jul 13, 2021
Heat spreader edge standoffs for managing bondline thickness in microelectronic packages
INTEL CORP0 citations59
US10763188B2Sep 1, 2020
Integrated heat spreader having electromagnetically-formed features
INTEL CORP1 citations57