Inventor
OGASHIWA TOSHINORI
JP23 patents
⚠️ This page may combine multiple inventors who share the name “OGASHIWA TOSHINORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TANAKA PRECIOUS METAL IND
9 patentsUS7789287B2Sep 7, 2010
Method of bonding
TANAKA PRECIOUS METAL IND10 citations82
US12000019B2Jun 4, 2024
Gold powder, production method for gold powder, and gold paste
TANAKA PRECIOUS METAL IND0 citations61
US12157170B2Dec 3, 2024
Conductive bonding material, bonding member including the conductive bonding material, and bonding method
TANAKA PRECIOUS METAL IND0 citations52
US11626334B2Apr 11, 2023
Through-hole sealing structure
TANAKA PRECIOUS METAL IND0 citations50
US9561952B2Feb 7, 2017
Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member
TANAKA PRECIOUS METAL IND0 citations50
US10366963B2Jul 30, 2019
Noble metal paste for bonding of semiconductor element
TANAKA PRECIOUS METAL IND0 citations47
US10870151B2Dec 22, 2020
Structure and method for sealing through-hole, and transfer substrate for sealing through-hole
TANAKA PRECIOUS METAL IND0 citations40
US10125015B2Nov 13, 2018
Package production method and package produced by the method
TANAKA PRECIOUS METAL IND0 citations39
US10256113B2Apr 9, 2019
Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate
TANAKA PRECIOUS METAL IND0 citations37
OGASHIWA TOSHINORI
6 patentsUS8505804B2Aug 13, 2013
Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device
OGASHIWA TOSHINORI8 citations82
US8962471B2Feb 24, 2015
Bump, method for forming the bump, and method for mounting substrate having the bump thereon
OGASHIWA TOSHINORI0 citations50
US8558433B2Oct 15, 2013
Metal paste for sealing, hermetic sealing method for piezoelectric element, and piezoelectric device
OGASHIWA TOSHINORI0 citations50
US8492894B2Jul 23, 2013
Bump, method for forming the bump, and method for mounting substrate having the bump thereon
OGASHIWA TOSHINORI0 citations50
US9065418B2Jun 23, 2015
Resonator electrode material excellent in aging property, piezoelectric resonator using the same material, and sputtering target made of the same material
OGASHIWA TOSHINORI0 citations46
US8912088B2Dec 16, 2014
Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate
OGASHIWA TOSHINORI0 citations36
TANAKA ELECTRONICS IND
5 patentsUS5550407AAug 27, 1996
Semiconductor device having an aluminum alloy wiring line
TANAKA ELECTRONICS IND23 citations92
US5514912AMay 7, 1996
Method for connecting semiconductor material and semiconductor device used in connecting method
TANAKA ELECTRONICS IND33 citations92
US5384090AJan 24, 1995
Fine wire for forming bump electrodes using a wire bonder
TANAKA ELECTRONICS IND20 citations92
US5366692ANov 22, 1994
Alloy connecting materials for semiconductors
TANAKA ELECTRONICS IND21 citations92
US5514334AMay 7, 1996
Fine lead alloy wire for forming bump electrodes
TANAKA ELECTRONICS IND3 citations62