Inventor
ARRINGTON KYLE
US13 patents
⚠️ This page may combine multiple inventors who share the name “ARRINGTON KYLE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS12238892B2Feb 25, 2025
Immersion cooling for integrated circuit devices
INTEL CORP3 citations72
US11622466B2Apr 4, 2023
Low force liquid metal interconnect solutions
INTEL CORP2 citations71
US11842944B2Dec 12, 2023
IC assemblies including die perimeter frames suitable for containing thermal interface materials
INTEL CORP2 citations64
US12349303B2Jul 1, 2025
Low force liquid metal interconnect solutions
INTEL CORP0 citations61
US11616000B2Mar 28, 2023
Methods and apparatus to provide electrical shielding for integrated circuit packages using a thermal interface material
INTEL CORP1 citations61
US12266589B2Apr 1, 2025
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US12057369B2Aug 6, 2024
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11881438B2Jan 23, 2024
First-level integration of second-level thermal interface material for integrated circuit assemblies
INTEL CORP0 citations59
US11854935B2Dec 26, 2023
Enhanced base die heat path using through-silicon vias
INTEL CORP0 citations59
US11832419B2Nov 28, 2023
Full package vapor chamber with IHS
INTEL CORP0 citations59
US11923268B2Mar 5, 2024
Printed heat spreader structures and methods of providing same
INTEL CORP0 citations56
US12046536B2Jul 23, 2024
Integrated heat spreader with enhanced vapor chamber for multichip packages
INTEL CORP0 citations51