Inventor
HA MINSEOK
US2 patents
Patents
2 patentsUS11842944B2Dec 12, 2023
IC assemblies including die perimeter frames suitable for containing thermal interface materials
INTEL CORP2 citations64
US11664294B2May 30, 2023
Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies
INTEL CORP0 citations47