Inventor

TSAU LIMING

US24 patents

⚠️ This page may combine multiple inventors who share the name “TSAU LIMING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAU LIMING

BROADCOM CORP

Metal-insulator-metal (MIM) capacitor

High-density metal capacitor using dual-damascene copper interconnect

High density metal capacitor using dual-damascene copper interconnect

High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process

System and method for one-time programmed memory through direct-tunneling oxide breakdown

System and method for one-time programmed memory through direct-tunneling oxide breakdown

High-density metal capacitor using dual-damascene copper interconnect

Metal bond pad for integrated circuits allowing improved probing ability of small pads

High density metal capacitor using via etch stopping layer as field dielectric in dual-damascence interconnect process

System and method for one-time programmed memory through direct-tunneling oxide breakdown

System and method to screen defect related reliability failures in CMOS SRAMS

AVAGO TECH INT SALES PTE LID

Photonics integration in semiconductor packages

Redistribution metal and under bump metal interconnect structures and method

Semiconductor package with side wall interconnection

Integrated antennas on side wall of 3D stacked die

Integrated circuit package with serpentine conductor and method of making

Semiconductor product with edge integrity detection structure

Redistribution metal and under bump metal interconnect structures and method

Mixed dielectric materials for improving signal integrity of integrated electronics packages

Cantilevered power planes to provide a return current path for high-speed signals

Die edge crack and delamination detection

NEWPORT FAB LLC

Dual-damascene interconnect structures and methods of fabricating same

AVAGO TECHNOLOGIES GENERAL IP

Integrated circuit with die edge assurance structure

WU ROBERT I

Semiconductor die with fuse window and a monitoring window over a structure which indicates fuse integrity