Inventor

HSU KUO-CHING

TW68 patents

⚠️ This page may combine multiple inventors who share the name “HSU KUO-CHING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSU KUO-CHING

TAIWAN SEMICONDUCTOR MFG CO LTD

Packages with interposers and methods for forming the same

3D packages and methods for forming the same

Isolation structure for stacked dies

Passivation layer for packaged chip

Packaging structures and methods with a metal pillar

Chip package structure with metal-containing layer

Chip package structure with conductive adhesive layer and method for forming the same

Package structure and method of fabricating the same

3D packages and methods for forming the same

3D packages and methods for forming the same

Package structure and method of fabricating the same

Packages with interposers and methods for forming the same

Semiconductor die package with conductive line crack prevention design

Semiconductor device and method of forming same

Packages including multiple encapsulated substrate blocks and overlapping redistribution structures

Method for forming a reconstructed package substrate comprising substrates blocks

3D packages and methods for forming the same

Three-dimensional chip stack and method of forming the same

Bonding structures in semiconductor packaged device and method of forming same

Semiconductor die package with conductive line crack prevention design

Chip package structure with metal-containing layer

Chip package structure with nickel layer

Bonding structures in semiconductor packaged device and method of forming same

Chip package structure with conductive adhesive layer

Semiconductor structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

3D packages and methods for forming the same

Backside connection to TSVs having redistribution lines

Bond pad connection to redistribution lines having tapered profiles

Three-dimensional chip stack and method of forming the same

Bump structures for semiconductor package

Bump structure for stacked dies

Optical clock signal distribution using through-silicon vias

Semiconductor device design methods and conductive bump pattern enhancement methods

Front side copper post joint structure for temporary bond in TSV application

Connector design for packaging integrated circuits

HSU KUO-CHING

Driving apparatus of light emitting diode and driving method thereof

Driving apparatus of light emitting diode and driving method thereof

Driving apparatus of light emitting diode and driving method thereof

Light source driving device capable of dynamically keeping constant current sink and related method

Bond pad connection to redistribution lines having tapered profiles

Control method capable of preventing flicker effect and light emitting device thereof

YU CHEN-HUA

Connector design for packaging integrated circuits

Wafer backside structures having copper pillars

Thin wafer handling structure and method

HUANG HON-LIN

Formation of TSV backside interconnects by modifying carrier wafers

Front side copper post joint structure for temporary bond in TSV application

TAIWAN SEMICONDUCTOR MANFACTUR

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

CHANG HUNG-PIN

Method of forming bump structure having tapered sidewalls for stacked dies

JENG SHIN-PUU

Passivation layer for packaged chip

NOVATEK MICROELECTRONICS CORP

LED device with simultaneous open and short detection function and method thereof