Inventor
SAMBUCETTI CARLOS J
38 patents
Patents
38 patentsUS6358832B1Mar 19, 2002
Method of forming barrier layers for damascene interconnects
IBM119 citations99
US6153935ANov 28, 2000
Dual etch stop/diffusion barrier for damascene interconnects
IBM376 citations99
US6503834B1Jan 7, 2003
Process to increase reliability CuBEOL structures
IBM79 citations98
US6335104B1Jan 1, 2002
Method for preparing a conductive pad for electrical connection and conductive pad formed
IBM155 citations98
US6268016B1Jul 31, 2001
Manufacturing computer systems with fine line circuitized substrates
IBM89 citations97
US6457234B1Oct 1, 2002
Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
IBM53 citations96
US4448804AMay 15, 1984
Method for selective electroless plating of copper onto a non-conductive substrate surface
IBM80 citations94
US4478883AOct 23, 1984
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
IBM57 citations93
US7033648B1Apr 25, 2006
Means of seeding and metallizing polyimide
IBM25 citations92
US6779711B2Aug 24, 2004
Self-aligned corrosion stop for copper C4 and wirebond
IBM18 citations92
US6197222B1Mar 6, 2001
Lead free conductive composites for electrical interconnections
IBM22 citations92
US5866044AFeb 2, 1999
Lead free conductive composites for electrical interconnections
IBM32 citations92
US5545429AAug 13, 1996
Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess
IBM25 citations92
US5509557AApr 23, 1996
Depositing a conductive metal onto a substrate
IBM40 citations92
US5310580AMay 10, 1994
Electroless metal adhesion to organic dielectric material with phase separated morphology
IBM38 citations92
US5105537AApr 21, 1992
Method for making a detachable electrical contact
IBM25 citations92
US5079070AJan 7, 1992
Repair of open defects in thin film conductors
IBM31 citations92
US4525390AJun 25, 1985
Deposition of copper from electroless plating compositions
IBM27 citations92
US6566612B2May 20, 2003
Method for direct chip attach by solder bumps and an underfill layer
IBM20 citations91
US6341418B1Jan 29, 2002
Method for direct chip attach by solder bumps and an underfill layer
IBM21 citations91
US4948707AAug 14, 1990
Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon
IBM52 citations91
US4554182ANov 19, 1985
Method for conditioning a surface of a dielectric substrate for electroless plating
IBM50 citations91
US7468320B2Dec 23, 2008
Reduced electromigration and stressed induced migration of copper wires by surface coating
IBM14 citations84
US6656750B1Dec 2, 2003
Method for testing chips on flat solder bumps
IBM17 citations84
US7273803B2Sep 25, 2007
Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
IBM16 citations82
US7081680B2Jul 25, 2006
Self-aligned corrosion stop for copper C4 and wirebond
IBM7 citations74
US5190463AMar 2, 1993
High performance metal cone contact
IBM15 citations74
US4211616AJul 8, 1980
Electrochromic printing system
IBM8 citations74
US6436803B2Aug 20, 2002
Manufacturing computer systems with fine line circuitized substrates
IBM11 citations73
US6339024B1Jan 15, 2002
Reinforced integrated circuits
IBM8 citations73
US4534797AAug 13, 1985
Method for providing an electroless copper plating bath in the take mode
IBM7 citations73
US4654126AMar 31, 1987
Process for determining the plating activity of an electroless plating bath
IBM14 citations72
US4593016AJun 3, 1986
Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
IBM11 citations72
US4441938AApr 10, 1984
Soldering flux
IBM14 citations72
US4371273AFeb 1, 1983
Electrochemical printhead
IBM10 citations66
US4415905ANov 15, 1983
Electrolytic printing process with wear resistant electrode
IBM4 citations59
US4820643AApr 11, 1989
Process for determining the activity of a palladium-tin catalyst
IBM3 citations58
US4264693AApr 28, 1981
Light and current sensitive film and print-display system therewith
IBM0 citations37