Inventor
YANG SHENG-CHIEH
TW21 patents
⚠️ This page may combine multiple inventors who share the name “YANG SHENG-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
10 patentsUS11177156B2Nov 16, 2021
Semiconductor package, manufacturing method of semiconductor device and semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations85
US11088124B2Aug 10, 2021
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11688725B2Jun 27, 2023
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11233039B2Jan 25, 2022
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11075131B2Jul 27, 2021
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12444719B2Oct 14, 2025
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322640B2Jun 3, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300684B2May 13, 2025
Semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12033992B2Jul 9, 2024
Package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776838B2Oct 3, 2023
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62