P

Inventor

LEE CHIA-EN

CN50 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHIA-EN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD

14 patents
US11456400B2Sep 27, 2022

Light-emitting diode and method for transferring the same

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD2 citations73
US10014460B2Jul 3, 2018

Flip-chip high-voltage light emitting device and fabrication method

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD4 citations68
US12106995B2Oct 1, 2024

Structure and method for transferring a micro semiconductor element by applying a separation force via a through hole

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations62
US11424387B2Aug 23, 2022

Micro light emitting diode chip and method for manufacturing micro light emitting diode device including the same

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD1 citations62
US11557580B2Jan 17, 2023

Method and device for mass transfer of micro semiconductor elements

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations61
US11127723B2Sep 21, 2021

Method for mass transfer of micro semiconductor elements

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations61
US12446363B2Oct 14, 2025

Light-emitting structure and light-emitting device including the same

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations52
US11804584B2Oct 31, 2023

Micro light-emitting element and device, and use and production method thereof

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations50
US11101239B2Aug 24, 2021

Process for packaging component

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations50
US10276750B2Apr 30, 2019

Bonding electrode structure of flip-chip led chip and fabrication method

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations50
US10283677B2May 7, 2019

LED structure and fabrication method

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations49
US12525588B2Jan 13, 2026

Micro light-emitting assembly, micro light-emitting device manufactured from the same and method for mass transfer of micro light-emitting devices

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations47
US10186637B2Jan 22, 2019

Flip-chip light emitting device and fabrication method

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations40
US10297733B2May 21, 2019

High-voltage light emitting diode chip and fabrication method

XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations39

LEE CHIA-EN

9 patents

XIAMEN SANAN OPTOELECTRONICS CO LTD

8 patents

LEXTAR ELECTRONICS CORP

7 patents

FIH HONG KONG LTD

5 patents

QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD

4 patents

UNIV NAT TAIWAN SCIENCE TECH

1 patent

SHENZHEN FUTAIHONG PREC IND CO

1 patent

HUBEI SANAN OPTOELECTRONICS CO LTD

1 patent