Inventor
LEE CHIA-EN
CN50 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHIA-EN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD
14 patentsUS11456400B2Sep 27, 2022
Light-emitting diode and method for transferring the same
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD2 citations73
US10014460B2Jul 3, 2018
Flip-chip high-voltage light emitting device and fabrication method
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD4 citations68
US12106995B2Oct 1, 2024
Structure and method for transferring a micro semiconductor element by applying a separation force via a through hole
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations62
US11424387B2Aug 23, 2022
Micro light emitting diode chip and method for manufacturing micro light emitting diode device including the same
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD1 citations62
US11557580B2Jan 17, 2023
Method and device for mass transfer of micro semiconductor elements
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations61
US11127723B2Sep 21, 2021
Method for mass transfer of micro semiconductor elements
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations61
US12446363B2Oct 14, 2025
Light-emitting structure and light-emitting device including the same
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations52
US11804584B2Oct 31, 2023
Micro light-emitting element and device, and use and production method thereof
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations50
US11101239B2Aug 24, 2021
Process for packaging component
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations50
US10276750B2Apr 30, 2019
Bonding electrode structure of flip-chip led chip and fabrication method
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations50
US10283677B2May 7, 2019
LED structure and fabrication method
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations49
US12525588B2Jan 13, 2026
Micro light-emitting assembly, micro light-emitting device manufactured from the same and method for mass transfer of micro light-emitting devices
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations47
US10186637B2Jan 22, 2019
Flip-chip light emitting device and fabrication method
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations40
US10297733B2May 21, 2019
High-voltage light emitting diode chip and fabrication method
XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD0 citations39
LEE CHIA-EN
9 patentsUS8278681B2Oct 2, 2012
Light-emitting diode package and wafer-level packaging process of light-emitting diode
LEE CHIA-EN7 citations81
USD668234SOct 2, 2012
LED chip
LEE CHIA-EN8 citations81
US8070320B2Dec 6, 2011
Laser illumination device with adjustable light output
LEE CHIA-EN4 citations62
USD680975SApr 30, 2013
LED chip
LEE CHIA-EN3 citations59
USD680976SApr 30, 2013
LED chip
LEE CHIA-EN4 citations59
USD669869SOct 30, 2012
LED chip
LEE CHIA-EN4 citations59
US8445327B2May 21, 2013
Light-emitting diode package and wafer-level packaging process of light-emitting diode
LEE CHIA-EN0 citations49
US8225670B2Jul 24, 2012
Device and method of testing a vibrating device
LEE CHIA-EN0 citations41
US8415683B2Apr 9, 2013
Light emitting diode chip
LEE CHIA-EN0 citations38
XIAMEN SANAN OPTOELECTRONICS CO LTD
8 patentsUS11804578B2Oct 31, 2023
Micro light-emitting device and display
XIAMEN SANAN OPTOELECTRONICS CO LTD1 citations62
US12040430B2Jul 16, 2024
Micro light-emitting element and device and transfer method thereof
XIAMEN SANAN OPTOELECTRONICS CO LTD0 citations61
US11616094B2Mar 28, 2023
Micro light-emitting component, micro light-emitting component matrix, and method for manufacturing the micro light-emitting component matrix
XIAMEN SANAN OPTOELECTRONICS CO LTD1 citations61
US11424385B2Aug 23, 2022
Micro light-emitting element and device and transfer method thereof
XIAMEN SANAN OPTOELECTRONICS CO LTD0 citations61
US11380829B2Jul 5, 2022
Light emitting device and light emitting device assembly
XIAMEN SANAN OPTOELECTRONICS CO LTD0 citations61
US11043613B2Jun 22, 2021
Light emitting diode device and method for manufacturing the same
XIAMEN SANAN OPTOELECTRONICS CO LTD0 citations60
US12376428B2Jul 29, 2025
Micro light-emitting diode and micro light-emitting device with rough surface and protection layer
XIAMEN SANAN OPTOELECTRONICS CO LTD0 citations52
US11742334B2Aug 29, 2023
Light-emitting assembly with raised adhesive layer
XIAMEN SANAN OPTOELECTRONICS CO LTD0 citations52
LEXTAR ELECTRONICS CORP
7 patentsUS8859311B2Oct 14, 2014
Flip-chip light-emitting diode structure and manufacturing method thereof
LEXTAR ELECTRONICS CORP9 citations82
US9472733B2Oct 18, 2016
LED display and manufacturing method thereof
LEXTAR ELECTRONICS CORP6 citations81
US9818915B2Nov 14, 2017
LED display and manufacturing method thereof
LEXTAR ELECTRONICS CORP1 citations60
US9484506B2Nov 1, 2016
LED display and manufacturing method thereof
LEXTAR ELECTRONICS CORP2 citations60
US9461213B2Oct 4, 2016
LED sub-mount and method for manufacturing light emitting device using the sub-mount
LEXTAR ELECTRONICS CORP1 citations49
US9054277B2Jun 9, 2015
Light-emitting diode with side-wall bump structure and mounting structure having the same
LEXTAR ELECTRONICS CORP1 citations49
US8362511B2Jan 29, 2013
Semiconductor light emitting structure
LEXTAR ELECTRONICS CORP0 citations35
FIH HONG KONG LTD
5 patentsUS7861429B2Jan 4, 2011
Thickness gauge
FIH HONG KONG LTD13 citations84
US8020284B2Sep 20, 2011
Production line
FIH HONG KONG LTD1 citations52
US7987965B2Aug 2, 2011
Assembly device
FIH HONG KONG LTD0 citations52
US7867020B2Jan 11, 2011
Fixture
FIH HONG KONG LTD0 citations52
US7596897B2Oct 6, 2009
Banner displaying device
FIH HONG KONG LTD0 citations52
QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD
4 patentsUS12237312B2Feb 25, 2025
Light-emitting diode packaging module
QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD0 citations48
US12230612B2Feb 18, 2025
Light-emitting diode packaging module having encapsulated array of LED chips
QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD0 citations48
US12230611B2Feb 18, 2025
Light-emitting device and display screen including the same
QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD0 citations48
US12080688B2Sep 3, 2024
Light-emitting diode packaging module
QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD0 citations48