Inventor
HILKENE MARTIN A
US24 patents
⚠️ This page may combine multiple inventors who share the name “HILKENE MARTIN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
18 patentsUS9390930B2Jul 12, 2016
Surface stabilization process to reduce dopant diffusion
APPLIED MATERIALS INC14 citations84
US9852902B2Dec 26, 2017
Material deposition for high aspect ratio structures
APPLIED MATERIALS INC3 citations72
US11171023B2Nov 9, 2021
Diode laser for wafer heating for EPI processes
APPLIED MATERIALS INC4 citations71
US12072267B2Aug 27, 2024
Method and hardware for post maintenance vacuum recovery system
APPLIED MATERIALS INC0 citations62
US8354035B2Jan 15, 2013
Method for removing implanted photo resist from hard disk drive substrates
APPLIED MATERIALS INC4 citations62
US7659184B2Feb 9, 2010
Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking
APPLIED MATERIALS INC3 citations61
US12449309B2Oct 21, 2025
Methods for detection using optical emission spectroscopy
APPLIED MATERIALS INC0 citations60
US11860973B2Jan 2, 2024
Method and system for foreline deposition diagnostics and control
APPLIED MATERIALS INC1 citations60
US11635338B2Apr 25, 2023
Rapid chamber vacuum leak check hardware and maintenance routine
APPLIED MATERIALS INC0 citations58
US9646642B2May 9, 2017
Resist fortification for magnetic media patterning
APPLIED MATERIALS INC0 citations52
US10276369B2Apr 30, 2019
Material deposition for high aspect ratio structures
APPLIED MATERIALS INC0 citations51
US10233538B2Mar 19, 2019
Demagnetization of magnetic media by C doping for HDD patterned media application
APPLIED MATERIALS INC0 citations51
US9553174B2Jan 24, 2017
Conversion process utilized for manufacturing advanced 3D features for semiconductor device applications
APPLIED MATERIALS INC0 citations51
US8003500B2Aug 23, 2011
Plasma immersion ion implantation process with chamber seasoning and seasoning layer plasma discharging for wafer dechucking
APPLIED MATERIALS INC1 citations51
US7989329B2Aug 2, 2011
Removal of surface dopants from a substrate
APPLIED MATERIALS INC1 citations51
US12037701B2Jul 16, 2024
Multi-thermal CVD chambers with shared gas delivery and exhaust system
APPLIED MATERIALS INC0 citations50
US7968401B2Jun 28, 2011
Reducing photoresist layer degradation in plasma immersion ion implantation
APPLIED MATERIALS INC0 citations50
US10500614B2Dec 10, 2019
Temperature controlled remote plasma clean for exhaust deposit removal
APPLIED MATERIALS INC0 citations41