Inventor
JANG HYEON-WOO
KR26 patents
⚠️ This page may combine multiple inventors who share the name “JANG HYEON-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
18 patentsUS11723191B2Aug 8, 2023
Semiconductor memory devices having protruding contact portions
SAMSUNG ELECTRONICS CO LTD8 citations85
US9177891B2Nov 3, 2015
Semiconductor device including contact pads
SAMSUNG ELECTRONICS CO LTD12 citations84
US9607994B2Mar 28, 2017
Methods of fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD8 citations83
US10714478B2Jul 14, 2020
Semiconductor devices with peripheral gate structures
SAMSUNG ELECTRONICS CO LTD5 citations82
US12016176B2Jun 18, 2024
Semiconductor memory device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations74
US9472617B2Oct 18, 2016
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations72
US8878293B2Nov 4, 2014
Semiconductor device having DC structure
SAMSUNG ELECTRONICS CO LTD5 citations72
US12279415B2Apr 15, 2025
Method of fabricating semiconductor memory device having protruding contact portion
SAMSUNG ELECTRONICS CO LTD0 citations62
US11948882B2Apr 2, 2024
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11495533B2Nov 8, 2022
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12464709B2Nov 4, 2025
Semiconductor memory device with buried contacts and a fence
SAMSUNG ELECTRONICS CO LTD0 citations60
US11832442B2Nov 28, 2023
Semiconductor memory device with buried contacts and a fence
SAMSUNG ELECTRONICS CO LTD0 citations60
US11502082B2Nov 15, 2022
Semiconductor devices with peripheral gate structures
SAMSUNG ELECTRONICS CO LTD0 citations60
US9536868B2Jan 3, 2017
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations52
US12598740B2Apr 7, 2026
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations49
US12588185B2Mar 24, 2026
Method of fabricating semiconductor memory device including capping layer
SAMSUNG ELECTRONICS CO LTD0 citations49
US12302556B2May 13, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US10056339B2Aug 21, 2018
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD1 citations49