Inventor
LEE WONIL
KR29 patents
⚠️ This page may combine multiple inventors who share the name “LEE WONIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS11653396B2May 16, 2023
Method and device for communication between network entities in cloud LAN environment
SAMSUNG ELECTRONICS CO LTD5 citations85
US11147107B2Oct 12, 2021
Method and device for communication between network entities in cloud LAN environment
SAMSUNG ELECTRONICS CO LTD9 citations85
US11574873B2Feb 7, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10736008B2Aug 4, 2020
Method and apparatus for controlling handover in a wireless communication system
SAMSUNG ELECTRONICS CO LTD2 citations72
US10306526B2May 28, 2019
Method and apparatus for controlling handover in a wireless communication system
SAMSUNG ELECTRONICS CO LTD3 citations72
US12414167B2Sep 9, 2025
Method and device for communication between network entities in cloud LAN environment
SAMSUNG ELECTRONICS CO LTD0 citations62
US12087696B2Sep 10, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12058744B2Aug 6, 2024
Method and device for communication between network entities in cloud LAN environment
SAMSUNG ELECTRONICS CO LTD0 citations62
US11297528B2Apr 5, 2022
Apparatus and method for controlling congestion in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations62
US11758454B2Sep 12, 2023
Method and apparatus for controlling handover in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations61
US11343739B2May 24, 2022
Method and apparatus for controlling handover in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations61
US12489071B2Dec 2, 2025
Semiconductor chip and semiconductor package including bonding layers having alignment marks
SAMSUNG ELECTRONICS CO LTD1 citations60
US12080691B2Sep 3, 2024
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations60
US12417988B2Sep 16, 2025
Interposer, method for fabricating the same, and semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11984415B2May 14, 2024
Interposer, method for fabricating the same, and semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD1 citations59
US11166193B2Nov 2, 2021
Terminal and base station in wireless communication system, and communication method thereof
SAMSUNG ELECTRONICS CO LTD0 citations56
US12512428B2Dec 30, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US12451449B2Oct 21, 2025
Semiconductor package, and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11317278B2Apr 26, 2022
Device and method for detecting mismatch of encryption parameter in wireless communication system
SAMSUNG ELECTRONICS CO LTD0 citations51
US12588567B2Mar 24, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11244894B2Feb 8, 2022
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations50