Inventor
WU HUANG-HUI
TW6 patents
Patents
6 patentsUS6204096B1Mar 20, 2001
Method for reducing critical dimension of dual damascene process using spin-on-glass process
UNITED MICROELECTRONICS CORP24 citations91
US6255162B1Jul 3, 2001
Method of gap filling
UNITED MICROELECTRONICS CORP15 citations82
US6239024B1May 29, 2001
Method of filling gap with dielectrics
UNITED MICROELECTRONICS CORP7 citations72
US6284645B1Sep 4, 2001
Controlling improvement of critical dimension of dual damasceue process using spin-on-glass process
UNITED MICROELECTRONICS CORP3 citations61
US6248662B1Jun 19, 2001
Method of improving gap filling characteristics of dielectric layer by implantation
UNITED MICROELECTRONICS CORP2 citations61
US6239027B1May 29, 2001
Method using a photoresist residue
UNITED MICROELECTRONICS CORP1 citations48