Inventor
LU CHEN-FA
TW22 patents
⚠️ This page may combine multiple inventors who share the name “LU CHEN-FA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS9793243B2Oct 17, 2017
Buffer layer(s) on a stacked structure having a via
TAIWAN SEMICONDUCTOR MFG CO LTD17 citations92
US10510723B2Dec 17, 2019
Buffer layer(s) on a stacked structure having a via
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11270978B2Mar 8, 2022
Buffer layer(s) on a stacked structure having a via
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10269701B2Apr 23, 2019
Semiconductor structure with ultra thick metal and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10128113B2Nov 13, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12021066B2Jun 25, 2024
Buffer layer(s) on a stacked structure having a via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670584B2Jun 6, 2023
Semiconductor structure with ultra thick metal and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11114378B2Sep 7, 2021
Semiconductor structure with ultra thick metal and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9508659B2Nov 29, 2016
Method and apparatus to protect a wafer edge
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations61
US10665456B2May 26, 2020
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10534353B2Jan 14, 2020
System and method to reduce pre-back-grinding process defects
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10134645B2Nov 20, 2018
Stress monitoring device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9418955B2Aug 16, 2016
Plasma treatment for semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
LU CHEN-FA
5 patentsUS8629053B2Jan 14, 2014
Plasma treatment for semiconductor devices
LU CHEN-FA4 citations72
US8716858B2May 6, 2014
Bump structure with barrier layer on post-passivation interconnect
LU CHEN-FA1 citations51
US8571699B2Oct 29, 2013
System and method to reduce pre-back-grinding process defects
LU CHEN-FA0 citations51
US8636559B2Jan 28, 2014
Method for wafer back-grinding control
LU CHEN-FA0 citations48
US8298041B2Oct 30, 2012
System and method for wafer back-grinding control
LU CHEN-FA0 citations48
TAIWAN SEMICONDUCTOR MFG
3 patentsUS6517413B1Feb 11, 2003
Method for a copper CMP endpoint detection system
TAIWAN SEMICONDUCTOR MFG105 citations94
US6555477B1Apr 29, 2003
Method for preventing Cu CMP corrosion
TAIWAN SEMICONDUCTOR MFG33 citations91
US6524959B1Feb 25, 2003
Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and control
TAIWAN SEMICONDUCTOR MFG11 citations73