Inventor

CHENG DAVID

US59 patents

⚠️ This page may combine multiple inventors who share the name “CHENG DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG DAVID

APPLIED MATERIALS INC

Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions

Process for CVD deposition of tungsten layer on semiconductor wafer

Multiple chamber integrated process system

Multichamber integrated process system

Magnetic field-enhanced plasma etch reactor

Dual cassette load lock

Multi-chamber integrated process system

Magnetic field-enhanced plasma etch reactor

Passive shield for CVD wafer processing which provides frontside edge exclusion and prevents backside depositions

System and method for detecting the center of an integrated circuit wafer

Multi-channel plasma discharge endpoint detection method

Process for the plasma treatment of the backside of a semiconductor wafer

Dual cassette load lock

Dual cassette load lock

Semiconductor processing system with robotic autoloader and load lock

Magnetron-enhanced plasma etching process

Semiconductor processing system with robotic autoloader and load lock

Semiconductor processing system with robotic autoloader and load lock

Laser interferometer system for monitoring and controlling IC processing

(unassigned)

Method and apparatus for integrated wafer handling and testing

Method for transporting and testing wafers

Method and apparatus for electroplating films on semiconductor wafers

Method and apparatus for loading and unloading wafers from a wafer carrier

Method and apparatus for mapping the edge and other characteristics of a workpiece

Method and apparatus for measuring sheet resistance and thickness of thin films and substrates

Multiple test probe system

Method and apparatus for handling and testing wafers

Method and apparatus for measuring thickness of semiconductor substrates

Method and apparatus for measuring sheet resistance and thickness of thin films and substrates

Method and apparatus for measuring film thickness

KOO ANN F

Method and apparatus for finding wafer index marks and centers

Method and apparatus for measuring surface topography

Method and apparatus for measuring the curvature of wafers with a laser source selecting device

Method and apparatus for measuring workpiece surface topography

Apparatus for measuring surface topography

Method and apparatus for measuring the curvature of wafers with beams of different wavelengths

Method and apparatus for measuring stress in a film applied to surface of a workpiece

XEROX CORP

Optical memory system for a reading/writing, verifying and tracking module

Optical disk

Radial access drive for an optical disk recorder

Motion blur compensation for moving media optical data recording system

CHENG DAVID

Method and apparatus for handling wafers

Violin shoulder rest

ZILLOW INC

Automatically determining a current value for a real estate property, such as a home, that is tailored to input from a human user, such as its owner

MASSACHUSETTS INST TECHNOLOGY

Techniques for clustering a set of objects

KOO ANN

Film stress measurement system having first and second stage means

PDG INC

Wheelchair member

FRONTIER SEMICONDUCTOR MEASURE

System for measuring the curvature of a semiconductor wafer

ANN KOO FIRST AMERICAN BUILDIN

System for measuring radii of curvatures

PDG PRODUCT DESIGN GROUP INC

Reconfigurable tilt wheelchair