Inventor
LOCKE PETER S
US15 patents
Patents
15 patentsUS6368484B1Apr 9, 2002
Selective plating process
IBM56 citations96
US6344125B1Feb 5, 2002
Pattern-sensitive electrolytic metal plating
IBM56 citations96
US6344129B1Feb 5, 2002
Method for plating copper conductors and devices formed
IBM46 citations96
US6471845B1Oct 29, 2002
Method of controlling chemical bath composition in a manufacturing environment
IBM63 citations95
US6333120B1Dec 25, 2001
Method for controlling the texture and microstructure of plated copper and plated structure
IBM49 citations92
US6270646B1Aug 7, 2001
Electroplating apparatus and method using a compressible contact
IBM82 citations92
US6413854B1Jul 2, 2002
Method to build multi level structure
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US6258717B1Jul 10, 2001
Method to produce high quality metal fill in deep submicron vias and lines
IBM5 citations74
US6592747B2Jul 15, 2003
Method of controlling additives in copper plating baths
IBM7 citations72
US6331237B1Dec 18, 2001
Method of improving contact reliability for electroplating
IBM12 citations70
US6660330B2Dec 9, 2003
Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support
IBM6 citations61
US6979393B2Dec 27, 2005
Method for plating copper conductors and devices formed
IBM0 citations52
US6600230B2Jul 29, 2003
Seedlayer for plating metal in deep submicron structures
IBM1 citations52
US7678258B2Mar 16, 2010
Void-free damascene copper deposition process and means of monitoring thereof
IBM1 citations51
US7227265B2Jun 5, 2007
Electroplated copper interconnection structure, process for making and electroplating bath
IBM1 citations51