Inventor
FANEUF BARRETT M
US22 patents
⚠️ This page may combine multiple inventors who share the name “FANEUF BARRETT M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
21 patentsUS6643132B2Nov 4, 2003
Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
INTEL CORP111 citations98
US6836407B2Dec 28, 2004
Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure
INTEL CORP82 citations97
US6560114B2May 6, 2003
Rack-mounted server and associated methods
INTEL CORP99 citations97
US7233491B2Jun 19, 2007
Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
INTEL CORP48 citations96
US7133283B2Nov 7, 2006
Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
INTEL CORP45 citations96
US6776221B2Aug 17, 2004
Computer system having a chassis-level capillary pump loop transferring heat to a frame-level thermal interface component
INTEL CORP57 citations96
US6981543B2Jan 3, 2006
Modular capillary pumped loop cooling system
INTEL CORP62 citations95
US6839237B2Jan 4, 2005
Electronics rack assemblies and associated components
INTEL CORP50 citations95
US6813149B2Nov 2, 2004
High capacity air-cooling systems for electronic apparatus and associated methods
INTEL CORP68 citations95
US6741465B2May 25, 2004
Cooling method and apparatus for handheld devices
INTEL CORP24 citations92
US6700785B2Mar 2, 2004
Computer system which locks a server unit subassembly in a selected position in a support frame
INTEL CORP49 citations92
US6693797B2Feb 17, 2004
Computer system having a chassis-level thermal interface component and a frame-level thermal interface component that are thermally engageable with and disengageable from one another
INTEL CORP54 citations92
US7770630B2Aug 10, 2010
Modular capillary pumped loop cooling system
INTEL CORP37 citations91
US7079388B2Jul 18, 2006
Baffles for high capacity air-cooling systems for electronics apparatus
INTEL CORP36 citations91
US11266043B2Mar 1, 2022
Liquid coolant based thermal energy management for containers receiving pluggable circuit modules
INTEL CORP6 citations72
US10945353B2Mar 9, 2021
Mechanism with folded wrapping to seal components immersed in coolant
INTEL CORP4 citations69
US11184997B2Nov 23, 2021
System to reduce coolant use in an array of circuit boards
INTEL CORP5 citations68
US12160971B2Dec 3, 2024
Jam for integration reliability of ruler form factor component
INTEL CORP0 citations60
US12131977B2Oct 29, 2024
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US11842943B2Dec 12, 2023
Electronic systems with inverted circuit board with heat sink to chassis attachment
INTEL CORP0 citations58
US12442712B2Oct 14, 2025
Liquid cooling system leak detection improvements
INTEL CORP0 citations55