Inventor
BALES TIM J
GB12 patents
Patents
12 patentsUS6922341B2Jul 26, 2005
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC17 citations91
US6851183B2Feb 8, 2005
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC8 citations81
US7282948B2Oct 16, 2007
MOS linear region impedance curvature correction
MICRON TECHNOLOGY INC6 citations72
US7579862B2Aug 25, 2009
MOS linear region impedance curvature correction
MICRON TECHNOLOGY INC4 citations61
US7403033B2Jul 22, 2008
MOS linear region impedance curvature correction
MICRON TECHNOLOGY INC2 citations61
US7256068B2Aug 14, 2007
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC1 citations61
US7166918B2Jan 23, 2007
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC2 citations61
US7091584B2Aug 15, 2006
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC2 citations61
US7432593B2Oct 7, 2008
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC0 citations51
US7414299B2Aug 19, 2008
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC0 citations51
US7221040B2May 22, 2007
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC0 citations51
US7176566B2Feb 13, 2007
Semiconductor package assembly and method for electrically isolating modules
MICRON TECHNOLOGY INC0 citations51