P

Inventor

LEE MING-HSUN

TW15 patents
⚠️ This page may combine multiple inventors who share the name “LEE MING-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TRIPLE WIN TECH SHENZHEN CO LTD

5 patents
US10623646B1Apr 14, 2020

Camera system and imaging method of camera system

TRIPLE WIN TECH SHENZHEN CO LTD3 citations71
US11736785B2Aug 22, 2023

Camera module

TRIPLE WIN TECH SHENZHEN CO LTD0 citations62
US11852944B2Dec 26, 2023

Electrochromic module, camera module, and electronic device

TRIPLE WIN TECH SHENZHEN CO LTD1 citations60
US12535720B2Jan 27, 2026

Camera module having embedded electronic element and steel sheet for improved heat dissipation, and electronic device having the same

TRIPLE WIN TECH SHENZHEN CO LTD0 citations52
US12309918B2May 20, 2025

Circuit board having embedded electronic component and method for manufacturing the same

TRIPLE WIN TECH SHENZHEN CO LTD0 citations41

SILICONWARE PRECISION INDUSTRIES CO LTD

3 patents
US6603196B2Aug 5, 2003

Leadframe-based semiconductor package for multi-media card

SILICONWARE PRECISION INDUSTRIES CO LTD185 citations98
US6388313B1May 14, 2002

Multi-chip module

SILICONWARE PRECISION INDUSTRIES CO LTD207 citations98
US6861736B2Mar 1, 2005

Leadframe-based semiconductor package for multi-media card

SILICONWARE PRECISION INDUSTRIES CO LTD4 citations62

SANDISK CORP

2 patents
US7375415B2May 20, 2008

Die package with asymmetric leadframe connection

SANDISK CORP23 citations92
US7728411B2Jun 1, 2010

COL-TSOP with nonconductive material for reducing package capacitance

SANDISK CORP12 citations84

LEE MING HSUN

2 patents
US8097495B2Jan 17, 2012

Die package with asymmetric leadframe connection

LEE MING HSUN7 citations82
US9909305B2Mar 6, 2018

Composite wall assembly

LEE MING HSUN5 citations65

UNIV MICHIGAN REGENTS

1 patent
US12532530B2Jan 20, 2026

Doped aluminum-alloyed gallium oxide and ohmic contacts

UNIV MICHIGAN REGENTS0 citations60

GIGA BYTE TECH CO LTD

1 patent
US11573784B2Feb 7, 2023

Electronic device for updating on-board data of power off status and electronic device package assembly

GIGA BYTE TECH CO LTD0 citations41

UPADHYAYULA SURESH

1 patent
US8575739B2Nov 5, 2013

Col-based semiconductor package including electrical connections through a single layer leadframe

UPADHYAYULA SURESH0 citations39