Inventor
MEINDL JAMES D
US23 patents
⚠️ This page may combine multiple inventors who share the name “MEINDL JAMES D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GEORGIA TECH RES INST
19 patentsUS7016569B2Mar 21, 2006
Back-side-of-die, through-wafer guided-wave optical clock distribution networks, method of fabrication thereof, and uses thereof
GEORGIA TECH RES INST295 citations98
US6528349B1Mar 4, 2003
Monolithically-fabricated compliant wafer-level package with wafer level reliability and functionality testability
GEORGIA TECH RES INST69 citations96
US7135777B2Nov 14, 2006
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
GEORGIA TECH RES INST49 citations95
US6785458B2Aug 31, 2004
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
GEORGIA TECH RES INST19 citations92
US6606432B2Aug 12, 2003
Phase mask consisting of an array of multiple diffractive elements for simultaneous accurate fabrication of large arrays of optical couplers and method for making same
GEORGIA TECH RES INST19 citations92
US7348786B2Mar 25, 2008
Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
GEORGIA TECH RES INST32 citations91
US7928563B2Apr 19, 2011
3-D ICs with microfluidic interconnects and methods of constructing same
GEORGIA TECH RES INST41 citations90
US6788867B2Sep 7, 2004
Backplane, printed wiring board, and/or multi-chip module-level optical interconnect layer having embedded air-gap technologies and methods of fabrication
GEORGIA TECH RES INST21 citations90
US7266267B2Sep 4, 2007
Microfluidic, optical, and electrical input output interconnects, methods of fabrication thereof, and methods of use thereof
GEORGIA TECH RES INST14 citations83
US7099525B2Aug 29, 2006
Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof
GEORGIA TECH RES INST15 citations83
US6807352B2Oct 19, 2004
Optical waveguides with embedded air-gap cladding layer and methods of fabrication thereof
GEORGIA TECH RES INST15 citations83
US7468558B2Dec 23, 2008
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof
GEORGIA TECH RES INST7 citations73
US7132736B2Nov 7, 2006
Devices having compliant wafer-level packages with pillars and methods of fabrication
GEORGIA TECH RES INST7 citations73
US6954576B2Oct 11, 2005
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package
GEORGIA TECH RES INST9 citations73
US7554347B2Jun 30, 2009
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
GEORGIA TECH RES INST4 citations60
US7906255B2Mar 15, 2011
Photo-masks and methods of fabricating periodic optical structures
GEORGIA TECH RES INST2 citations59
US6947651B2Sep 20, 2005
Optical waveguides formed from nano air-gap inter-layer dielectric materials and methods of fabrication thereof
GEORGIA TECH RES INST5 citations57
US7935459B2May 3, 2011
Photo-masks and methods of fabricating surface-relief grating diffractive devices
GEORGIA TECH RES INST2 citations55
US7994590B2Aug 9, 2011
High dielectric constant insulators and associated fabrication methods
GEORGIA TECH RES INST0 citations42
UNIV LELAND STANFORD JUNIOR
3 patentsUS4152678AMay 1, 1979
Cascade charge coupled delay line device for compound delays
UNIV LELAND STANFORD JUNIOR53 citations92
US3979711ASep 7, 1976
Ultrasonic transducer array and imaging system
UNIV LELAND STANFORD JUNIOR46 citations92
US4285001AAug 18, 1981
Monolithic distributed resistor-capacitor device and circuit utilizing polycrystalline semiconductor material
UNIV LELAND STANFORD JUNIOR28 citations81