Inventor

PROBSTFIELD ERIK M

US3 patents

Patents

3 patents

US7288492B2Oct 30, 2007

Method for forming interconnects on thin wafers

IBM7 citations70

US6951775B2Oct 4, 2005

Method for forming interconnects on thin wafers

IBM2 citations59

US7844099B2Nov 30, 2010

Inspection method for protecting image sensor devices with front surface protection

IBM1 citations49