Inventor
WANG FENG-KU
TW29 patents
⚠️ This page may combine multiple inventors who share the name “WANG FENG-KU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENTEC CORP
17 patentsUS6373700B1Apr 16, 2002
Heat sink modular structure inside an electronic product
INVENTEC CORP91 citations98
US7388747B2Jun 17, 2008
Heat plate fixing structure
INVENTEC CORP28 citations92
US7339787B2Mar 4, 2008
Heat sink module for dissipating heat from a heat source on a motherboard
INVENTEC CORP32 citations92
US7405937B1Jul 29, 2008
Heat sink module for dual heat sources
INVENTEC CORP34 citations90
US5873407AFeb 23, 1999
Windblown-type heat-dissipating device for computer mother board
INVENTEC CORP25 citations89
US7436673B2Oct 14, 2008
Heat sink fixing assembly
INVENTEC CORP14 citations84
US7946336B2May 24, 2011
Heat sink structure
INVENTEC CORP12 citations82
US7558062B2Jul 7, 2009
Heat-dissipating module and electronic apparatus
INVENTEC CORP17 citations81
US7564686B2Jul 21, 2009
Heat-dissipating module
INVENTEC CORP7 citations74
US8363400B2Jan 29, 2013
Circuit module and electronic device using the same
INVENTEC CORP2 citations63
US7463484B2Dec 9, 2008
Heatsink apparatus
INVENTEC CORP5 citations63
US7457119B2Nov 25, 2008
Heatsink module
INVENTEC CORP5 citations63
US7589969B2Sep 15, 2009
Folding protective cover for heat-conductive medium
INVENTEC CORP6 citations62
US7940528B2May 10, 2011
Electronic device and heat sink thereof
INVENTEC CORP3 citations61
US7826227B2Nov 2, 2010
Heat dissipation device
INVENTEC CORP5 citations61
US7954541B2Jun 7, 2011
Heat dissipation module
INVENTEC CORP2 citations58
US7757627B2Jul 20, 2010
Automatic coating device
INVENTEC CORP0 citations52
INVENTEC PUDONG TECH CORP
6 patentsUS9740253B2Aug 22, 2017
Electronic apparatus
INVENTEC PUDONG TECH CORP35 citations93
US9557785B2Jan 31, 2017
Computer device with heat-dissipation channels
INVENTEC PUDONG TECH CORP9 citations83
US9029696B2May 12, 2015
Electronic device
INVENTEC PUDONG TECH CORP3 citations63
US8897012B2Nov 25, 2014
Electronic device and heat dissipation module thereof
INVENTEC PUDONG TECH CORP2 citations62
US9131626B2Sep 8, 2015
Electronic device including a jet flow generator
INVENTEC PUDONG TECH CORP1 citations52
US9119323B2Aug 25, 2015
Electronic device
INVENTEC PUDONG TECH CORP0 citations42
WANG FENG-KU
5 patentsUS8482916B2Jul 9, 2013
Mobile computing apparatus
WANG FENG-KU8 citations83
US8641271B2Feb 4, 2014
Method for testing heat pipes
WANG FENG-KU4 citations72
US8340922B2Dec 25, 2012
Method for estimating fan life
WANG FENG-KU5 citations61
US8078438B2Dec 13, 2011
Method for simulating thermal resistance value of thermal test die
WANG FENG-KU2 citations61
US8388221B2Mar 5, 2013
Method for detecting performances of heat dissipation modules
WANG FENG-KU0 citations40