Inventor
KIM KYUNGSOO
KR28 patents
⚠️ This page may combine multiple inventors who share the name “KIM KYUNGSOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
21 patentsUS9911828B2Mar 6, 2018
Methods of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations69
US7714638B2May 11, 2010
Eased gate voltage restriction via body-bias voltage governor
SAMSUNG ELECTRONICS CO LTD6 citations69
US7332954B2Feb 19, 2008
Eased gate voltage restriction via body-bias voltage governor
SAMSUNG ELECTRONICS CO LTD8 citations69
US11620135B2Apr 4, 2023
Booting method of computing system including memory module with processing device mounted
SAMSUNG ELECTRONICS CO LTD0 citations59
US11531618B2Dec 20, 2022
Memory modules and methods of operating same
SAMSUNG ELECTRONICS CO LTD0 citations59
US12236098B2Feb 25, 2025
Memory device and scheduling method thereof
SAMSUNG ELECTRONICS CO LTD0 citations57
US12499072B2Dec 16, 2025
Memory module, system including the same, and operation method of memory module
SAMSUNG ELECTRONICS CO LTD0 citations56
US12432916B2Sep 30, 2025
Storage device, storage system, and operation method of storage device
SAMSUNG ELECTRONICS CO LTD0 citations52
US12561271B2Feb 24, 2026
Computing systems having congestion monitors therein and methods of controlling operation of same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12356661B2Jul 8, 2025
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US11531496B2Dec 20, 2022
Memory modules and memory systems having the same
SAMSUNG ELECTRONICS CO LTD0 citations49
US12526994B2Jan 13, 2026
Three dimensional semiconductor device and a method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12495574B2Dec 9, 2025
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations47
US12477822B2Nov 18, 2025
Three-dimensional semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12446304B2Oct 14, 2025
Integrated circuit semiconductor element having heterogeneous gate structures and method of fabricating integrated circuit semiconductor element
SAMSUNG ELECTRONICS CO LTD0 citations47
US12342521B2Jun 24, 2025
Static random-access memory (SRAM) device including three-dimensional stacked (3DS) field-effect transistor (FET) and layout thereof
SAMSUNG ELECTRONICS CO LTD0 citations47
US12079146B2Sep 3, 2024
Memory module, main board, and server device
SAMSUNG ELECTRONICS CO LTD0 citations47
US12534842B2Jan 27, 2026
User terminal and control method for same
SAMSUNG ELECTRONICS CO LTD0 citations46
US12402406B2Aug 26, 2025
Semiconductor integrated circuit device and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD0 citations46
US12236099B2Feb 25, 2025
Accelerator module and computing system including the same
SAMSUNG ELECTRONICS CO LTD0 citations46
US12272423B2Apr 8, 2025
Methods of operating a near memory processing-dual in-line memory module (NMP-DIMM) for performing a read operation and an adaptive latency module and a system thereof
SAMSUNG ELECTRONICS CO LTD0 citations43
LG ELECTRONICS INC
2 patentsUS9924503B2Mar 20, 2018
Method and apparatus for performing device-to-device communication in wireless communication system
LG ELECTRONICS INC17 citations93
US9642128B2May 2, 2017
Method and apparatus for performing device-to-device communication in wireless communication system
LG ELECTRONICS INC9 citations83