Inventor
WU CHUNG JU
TW26 patents
⚠️ This page may combine multiple inventors who share the name “WU CHUNG JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICON INTEGRATED SYS CORP
15 patentsUS6395996B1May 28, 2002
Multi-layered substrate with a built-in capacitor design
SILICON INTEGRATED SYS CORP104 citations97
US7307844B2Dec 11, 2007
Heat dissipation mechanism for electronic apparatus
SILICON INTEGRATED SYS CORP33 citations92
US6653574B2Nov 25, 2003
Multi-layered substrate with a built-in capacitor design and a method of making the same
SILICON INTEGRATED SYS CORP17 citations92
US6524942B2Feb 25, 2003
Bond pad structure and its method of fabricating
SILICON INTEGRATED SYS CORP17 citations92
US6365970B1Apr 2, 2002
Bond pad structure and its method of fabricating
SILICON INTEGRATED SYS CORP21 citations92
US6116427ASep 12, 2000
Tray for ball grid array devices
SILICON INTEGRATED SYS CORP30 citations92
US6747350B1Jun 8, 2004
Flip chip package structure
SILICON INTEGRATED SYS CORP51 citations89
US6509646B1Jan 21, 2003
Apparatus for reducing an electrical noise inside a ball grid array package
SILICON INTEGRATED SYS CORP18 citations84
US6882037B2Apr 19, 2005
Die paddle for receiving an integrated circuit die in a plastic substrate
SILICON INTEGRATED SYS CORP7 citations73
US6933600B2Aug 23, 2005
Substrate for semiconductor package
SILICON INTEGRATED SYS CORP10 citations72
US6765301B2Jul 20, 2004
Integrated circuit bonding device and manufacturing method thereof
SILICON INTEGRATED SYS CORP9 citations72
US6753595B1Jun 22, 2004
Substrates for semiconductor devices with shielding for NC contacts
SILICON INTEGRATED SYS CORP9 citations71
US6744128B2Jun 1, 2004
Integrated circuit package capable of improving signal quality
SILICON INTEGRATED SYS CORP2 citations61
US7193314B2Mar 20, 2007
Semiconductor devices and substrates used in thereof
SILICON INTEGRATED SYS CORP2 citations60
US6838756B2Jan 4, 2005
Chip-packaging substrate
SILICON INTEGRATED SYS CORP0 citations52
HTC CORP
6 patentsUS12025295B2Jul 2, 2024
Wearable device and head strap module
HTC CORP0 citations56
US11927303B2Mar 12, 2024
Wearable device
HTC CORP0 citations56
US9547282B2Jan 17, 2017
Wearable device with wireless transmission and method for manufacturing the same
HTC CORP1 citations49
US9475016B2Oct 25, 2016
Fluid mixing structure
HTC CORP0 citations47
US9897620B2Feb 20, 2018
Gas detection device and gas inlet module thereof
HTC CORP0 citations37
US9669408B2Jun 6, 2017
Slight volume collector
HTC CORP0 citations37