Inventor

LIN CHIA-HSIANG

TW21 patents

⚠️ This page may combine multiple inventors who share the name “LIN CHIA-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN CHIA-HSIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structure and method of fabricating the same

Multi fan-out package structure and method for forming the same

Eccentric via structures for stress reduction

Package structure with reinforced element

Stacking via structures for stress reduction

Package and method for forming the same

Eccentric via structures for stress reduction

Stacking via structures for stress reduction

Stacking via structures for stress reduction

Package structure with reinforced element and formation method thereof

Method of fabricating package structure

TAIWAN SEMICONDUCTOR MFG

Method of improving via filling uniformity in isolated and dense via-pattern regions

Method of overlay measurement for alignment of patterns in semiconductor manufacturing

MEDIATEK INC

Charger circuit with battery protection mechanism

Method for performing adaptive input current control in an electronic device with aid of adaptor management, and associated apparatus

LITE ON IT CORP

Auxiliary operation interface of digital recording and reproducing apparatus

WANG CHIEN-WEI

Patterning process and materials for lithography

YU CHUN HUI

Method of forming interconnects for three dimensional integrated circuit

LU CHIEN-PING

Charging control circuit

LU HSIAO-TZU

System for overlay measurement in semiconductor manufacturing

CHEN KUEI-SHUN

Method and apparatus for planarizing gap-filling material