Inventor

PARK HYO-BIN

KR3 patents

⚠️ This page may combine multiple inventors who share the name “PARK HYO-BIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

2 patents

US9040838B2May 26, 2015

Method for forming solder resist and substrate for package

SAMSUNG ELECTRO MECH6 citations69

US10553452B2Feb 4, 2020

Printed circuit board, method, and semiconductor package

SAMSUNG ELECTRO MECH4 citations66

LEE DOO-HWAN

1 patent

US8206530B2Jun 26, 2012

Manufacturing method of printed circuit board having electro component

LEE DOO-HWAN2 citations60