Inventor

HO MING-CHE

TW116 patents

⚠️ This page may combine multiple inventors who share the name “HO MING-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO MING-CHE

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor package and manufacturing method thereof

Electronic device and manufacturing method thereof

Packae structure, RDL structure and method of forming the same

Integrated fan-out package and method of fabricating the same

Package structures and methods for forming the same

Via structure for packaging and a method of forming

Integrated fan-out package, redistribution circuit structure, and method of fabricating the same

Semiconductor package and method of forming the same

Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and method of forming the same

Integrated circuit package and method

Integrated fan-out package and method of fabricating the same

Integrated fan-out packages and methods of forming the same

Semicondcutor package and manufacturing method thereof

Semiconductor device and method

Packaging devices and methods

Copper-containing layer on under-bump metallization layer

Semiconductor package and method

Bonding package components through plating

Adjusting sizes of connectors of package components

Package structure and method of forming the same

Bonding structures and methods forming the same

Package structure and method of fabricating the same

Integrated circuit package and method

Semiconductor structure and method of forming the same

Integrated circuit package and method

Integrated circuit package and method

Forming bonding structures by using template layer as templates

Via structure for packaging and a method of forming

TAIWAN SEMICONDUCTOR MFG

Packaging devices and methods

Package on package devices and methods of packaging semiconductor dies

Method of fabricating bump structure and bump structure

HSU CHUN-LEI

Package on package devices and methods of packaging semiconductor dies

Method of fabricating bump structure

DELTA ELECTRONICS INC

Power-transforming device

Evenly heat-dissipating apparatus

LIU CHUNG-SHI

Preventing UBM oxidation in bump formation processes

Protection layer for preventing UBM layer from chemical attack and oxidation

CHENG MING-DA

Mechanisms for forming copper pillar bumps

LU WEN-HSIUNG

Conductive pillar for semiconductor substrate and method of manufacture

HO MING-CHE

CMP by controlling polish temperature

CHEN YU-FENG

Crack stopper on under-bump metallization layer

WU YI-WEN

Post-passivation interconnect structure and method of forming the same

HSIAO YI-LI

Wafer&#39;s ambiance control

LAI CHIH-WEI

Adjusting sizes of connectors of package components

ETRON TECH INC

Image calibration system and calibration method of a stereo camera

LIN CHIH-WEI

Activation treatments in plating processes

CHANG SONG-YUAN

Polishing composition for planarizing metal layer

Wafer's ambiance control