Inventor

TAN XIAOCHUN

CN37 patents

⚠️ This page may combine multiple inventors who share the name “TAN XIAOCHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAN XIAOCHUN

SILERGY SEMICONDUCTOR TECHNOLOGY HANGZHOU LTD

Lead frame, manufacture method and package structure thereof

Multi-level package assembly having conductive vias coupled to chip carrier for each level and method for manufacturing the same

Lead frame and flip chip package device thereof

Stacked package structure and stacked packaging method for chip

Package structure and method thereof

Package structure and method therof

Chip package structure and manufacturing method therefor

Chip packaging structure of a plurality of assemblies

Chip package and method for forming the same

Flip-chip package structure and method for an integrated switching power supply

Lead frame and semiconductor package structure thereof

Lead frame and flip packaging device thereof

Stacked package structure and stacked packaging method for chip

Stacked package structure and stacked packaging method for chip

Chip package method for reducing chip leakage current

Flip chip package structure and fabrication process thereof

Flip chip package structure and fabrication process thereof

Flip-chip package structure and method for an integrated switching power supply

Multi-chip stacked package and method for forming the same

Multi-component chip packaging structure

Integrated package assembly for switching regulator

Package assembly having interconnect for stacked electronic devices and method for manufacturing the same

Integrated package assembly for switching regulator

Package assembly and method for manufacturing the same

Chip package method and package assembly

Multi-chip packaging structure and method

MICROSOFT CORP

User interface for a display screen

User interface for a display screen

User interface for a display screen

SHANGHAI KAIHONG TECHNOLOGY CO

Chip scale package fabrication methods

Wire bonded chip scale package fabrication methods

Thin quad flat package with no leads (QFN) fabrication methods

CHEN WEI

Chip package structure and method of making the same

Chip package structure and method of making the same

HEFEI SMAT TECH CO LTD

Method of manufacturing chip packaging structure with dissipation layer, flange and sealing pin

Chip packaging structure with heat dissipation layer, flange and sealing pin

SHANGHAI KAIHONG TECHNOLOGY CO LTD

Thin quad flat package with no leads (QFN) fabrication methods