Inventor
KO WONJUN
KR18 patents
⚠️ This page may combine multiple inventors who share the name “KO WONJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KO WONJUN
7 patentsUS8609463B2Dec 17, 2013
Integrated circuit package system employing multi-package module techniques
KO WONJUN11 citations82
US8536718B2Sep 17, 2013
Integrated circuit packaging system with trenches and method of manufacture thereof
KO WONJUN16 citations82
US8546957B2Oct 1, 2013
Integrated circuit packaging system with dielectric support and method of manufacture thereof
KO WONJUN5 citations72
US8569882B2Oct 29, 2013
Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof
KO WONJUN5 citations71
US9076802B1Jul 7, 2015
Dual-sided film-assist molding process
KO WONJUN6 citations68
US8618653B2Dec 31, 2013
Integrated circuit package system with wafer scale heat slug
KO WONJUN1 citations51
US8067275B2Nov 29, 2011
Integrated circuit package system with package integration
KO WONJUN0 citations49
STATS CHIPPAC LTD
3 patentsUS8035211B2Oct 11, 2011
Integrated circuit package system with support structure under wire-in-film adhesive
STATS CHIPPAC LTD12 citations79
US8022538B2Sep 20, 2011
Base package system for integrated circuit package stacking and method of manufacture thereof
STATS CHIPPAC LTD1 citations52
US9279673B2Mar 8, 2016
Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage
STATS CHIPPAC LTD1 citations50
CHOI DAESIK
2 patentsUS8263435B2Sep 11, 2012
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias
CHOI DAESIK47 citations96
US9252032B2Feb 2, 2016
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias
CHOI DAESIK6 citations83
SONG SUNGMIN
2 patentsYUN JAEUN
2 patentsUS8524537B2Sep 3, 2013
Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue
YUN JAEUN4 citations57
US8415204B2Apr 9, 2013
Integrated circuit packaging system with heat spreader and method of manufacture thereof
YUN JAEUN0 citations47