Inventor

LIM TAEG KI

KR11 patents

⚠️ This page may combine multiple inventors who share the name “LIM TAEG KI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

4 patents

US7737539B2Jun 15, 2010

Integrated circuit package system including honeycomb molding

STATS CHIPPAC LTD30 citations91

US7443037B2Oct 28, 2008

Stacked integrated circuit package system with connection protection

STATS CHIPPAC LTD10 citations82

US7656017B2Feb 2, 2010

Integrated circuit package system with thermo-mechanical interlocking substrates

STATS CHIPPAC LTD14 citations80

US7969023B2Jun 28, 2011

Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof

STATS CHIPPAC LTD0 citations50

KWON HYEOG CHAN

2 patents

US8067831B2Nov 29, 2011

Integrated circuit package system with planar interconnects

KWON HYEOG CHAN6 citations59

US8217501B2Jul 10, 2012

Integrated circuit package system including honeycomb molding

KWON HYEOG CHAN1 citations48

KO WONJUN

2 patents

US8618653B2Dec 31, 2013

Integrated circuit package system with wafer scale heat slug

KO WONJUN1 citations51

US8067275B2Nov 29, 2011

Integrated circuit package system with package integration

KO WONJUN0 citations49

JU JONG WOOK

1 patent

US8659175B2Feb 25, 2014

Integrated circuit package system with offset stack

JU JONG WOOK4 citations66

KUAN HEAP HOE

1 patent

US8409921B2Apr 2, 2013

Integrated circuit package system including honeycomb molding

KUAN HEAP HOE1 citations51

HA JONG-WOO

1 patent

US8987056B2Mar 24, 2015

Integrated circuit package system with support carrier and method of manufacture thereof

HA JONG-WOO0 citations49