Inventor
YEN YU-LIN
TW25 patents
⚠️ This page may combine multiple inventors who share the name “YEN YU-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YEN YU-LIN
11 patentsUS8692382B2Apr 8, 2014
Chip package
YEN YU-LIN23 citations92
US8525345B2Sep 3, 2013
Chip package and method for forming the same
YEN YU-LIN21 citations92
US9136241B2Sep 15, 2015
Chip package and manufacturing method thereof
YEN YU-LIN4 citations71
US9559001B2Jan 31, 2017
Chip package and method for forming the same
YEN YU-LIN5 citations70
US9024437B2May 5, 2015
Chip package and method for forming the same
YEN YU-LIN2 citations62
US8698316B2Apr 15, 2014
Chip package
YEN YU-LIN3 citations62
US8581386B2Nov 12, 2013
Chip package
YEN YU-LIN4 citations62
US8552565B2Oct 8, 2013
Chip package and method for forming the same
YEN YU-LIN3 citations62
US8003442B2Aug 23, 2011
Integrated cirucit package and method for fabrication thereof
YEN YU-LIN2 citations60
US8415088B2Apr 9, 2013
Method for forming a material layer
YEN YU-LIN0 citations51
US8624383B2Jan 7, 2014
Integrated circuit package and method for fabrication thereof
YEN YU-LIN0 citations50
MACRONIX INT CO LTD
8 patentsUS7196429B2Mar 27, 2007
Method of reducing film stress on overlay mark
MACRONIX INT CO LTD18 citations92
US7323393B2Jan 29, 2008
Method of reducing film stress on overlay mark
MACRONIX INT CO LTD6 citations74
US7192845B2Mar 20, 2007
Method of reducing alignment measurement errors between device layers
MACRONIX INT CO LTD7 citations74
US7125741B2Oct 24, 2006
Rework process of patterned photo-resist layer
MACRONIX INT CO LTD10 citations74
US7781126B2Aug 24, 2010
Mask and pattern forming method by using the same
MACRONIX INT CO LTD2 citations62
US7314813B2Jan 1, 2008
Methods of forming planarized multilevel metallization in an integrated circuit
MACRONIX INT CO LTD5 citations61
US6960411B2Nov 1, 2005
Mask with extended mask clear-out window and method of dummy exposure using the same
MACRONIX INT CO LTD1 citations51
US7097921B2Aug 29, 2006
Sandwich arc structure for preventing metal to contact from shifting
MACRONIX INT CO LTD0 citations45
XINTEC INC
4 patentsUS9184092B2Nov 10, 2015
Chip package and method for forming the same
XINTEC INC2 citations62
US8951836B2Feb 10, 2015
Chip package and method for forming the same
XINTEC INC2 citations62
US9236429B2Jan 12, 2016
Semiconductor structure and manufacturing method thereof
XINTEC INC2 citations57
US9196589B2Nov 24, 2015
Stacked wafer structure and method for stacking a wafer
XINTEC INC0 citations45