Inventor
MASUDA TAKATOSHI
JP16 patents
⚠️ This page may combine multiple inventors who share the name “MASUDA TAKATOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
9 patentsUS8025556B2Sep 27, 2011
Method of grinding wafer
DISCO CORP14 citations83
US7622328B2Nov 24, 2009
Processing method of wafer
DISCO CORP8 citations83
US7608481B2Oct 27, 2009
Method for producing semiconductor package
DISCO CORP12 citations83
US7677955B2Mar 16, 2010
Grinding method for wafer
DISCO CORP12 citations82
US7278903B2Oct 9, 2007
Processing method for wafer and processing apparatus therefor
DISCO CORP8 citations73
US7858530B2Dec 28, 2010
Processing method for wafer and processing apparatus therefor
DISCO CORP6 citations62
US7718511B2May 18, 2010
Processing method for wafer
DISCO CORP3 citations62
US7439162B2Oct 21, 2008
Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform
DISCO CORP4 citations57
US9159622B2Oct 13, 2015
Dividing method for wafer
DISCO CORP1 citations44
MITSUBISHI ELECTRIC CORP
4 patentsUS11616407B2Mar 28, 2023
Segment-core coupled body and method of manufacturing armature
MITSUBISHI ELECTRIC CORP20 citations94
US10756588B2Aug 25, 2020
Stator for rotary electric machine
MITSUBISHI ELECTRIC CORP2 citations71
US11095173B2Aug 17, 2021
Stator for rotating electric machine, and rotating electric machine
MITSUBISHI ELECTRIC CORP0 citations51
US10886823B2Jan 5, 2021
Stator for rotary electric machine, rotary electric machine, and method for manufacturing stator for rotary electric machine
MITSUBISHI ELECTRIC CORP0 citations50